Lucent Technologies Inc.

Agere Systems Optoelectronics Guardian Corp.

Philip J Hubbauer

John David Weld

Lloyd Shepherd

William Roger Lambert

John Burnette MacChesney

Alan Michael Lyons

George J Shevchuk

Louis Thomas Manzione

David Wilfred Johnson

Debra Anne Fleming

Christopher F Zappala

Thomas Edward Stockert

Donald W Dahringer

John Stanley Rucki

Frederick W Walz, Jr

Robert LeRoy Decker

Peter Giannoglou

Steven C Andry

A multi-layer backplane for processing radio frequency (RF) and other signals has alternating layers of conductive traces for RF signals and other types of signals, and ground plane layers of conductive material electrically insulated from each other. The backplane upper layer has a plurality of coaxial connectors for connection of cables and other devices which supply RF energy signals to and convey them from the backplane, with each connector having a center pin extending into the backplane to make electrical contact with a trace of a selected trace layer. A ground plane cap layer of electrically conductive material is provided below the last ground plane layer associated with a trace layer and beneath the coaxial connector center pins for preventing leakage of radio frequency energy between the center pins. A row of conductive vias can be provided along one or more sides of a trace carrying RF energy. These vias are connected to electrical ground references above and below the layer of the trace to electrically isolate the trace from radiating the RF energy. Portions of transition conductive vias and plated-through holes for the connector center pins are removed to adjust to the impedance of components and cables to which they are to be connected.

Backplane for radio frequency signals

An optical fiber cable connector assembly comprising two connectors each of which is comprised of a rigid inorganic body which is coated with an organic layer into which grooves are formed which are adapted to restrain the ends of two fiber optic cables. One connector is adapted to fit over the other when inverted to form the assembly with one or more fiber optic cables restrained between them.

Substrate based array connector

The invention is a sol-gel extrusion process which allows fabrication of both thick and thin wall tubes. For example, the process is capable of preparing silica overcladding tubes in a manner easier than sol-gel casting processes, and also capable of preparing relatively thin substrate tubes, which are difficult to cast. According to the invention, a silica dispersion containing a stabilizing agent is provided, a gelling agent is added to the dispersion to induce gellation, and the resultant gel is extruded into a silica body, in the substantial absence of polymeric material from the gel. Substantially avoiding the inclusion of such polymeric material in overcladding and substrate tubes offers significant commercial advantages by reducing the time and energy required to remove organic materials from the tube bodies, by reducing environmental impact, and by reducing the amount of impurities introduced in the tubes.

Process for fabricating silica article utilizing sol-gel extrusion

A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade of polymer used to fabricate the body portion. The body portion has top and bottom openings adapted to receive the top and bottom cap portions. The network interface electrical components are enclosed within the housing.

Weatherable outside electronic device enclosure

An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production. Thus, electronic products can be provided with an assembly having an environment protection capability and EMI shielding capability amenable to reliable and cost effective high volume production.

Method for protecting electronic circuit components

Growing community of inventors

West Caldwell, NJ, United States of America

Philip J Hubbauer