Intermedics Inc.

Miradia Inc.

Cisco Technology, Inc.

Broadcom Corporation

Sulzer Intermedics, Inc.

Philip H Chen

Sha Ma

Dongmin Chen

Chien-Hsien Wu

Xiao “Charles” Yang

Vamsi M Tatapudi

Felice Bonardi

Dennis M Gibson

Bruce Hui Kwan

Xiao Charles Yang

Cuong Van Pham

Kenneth R Ulmer

Timothy Michael Gadd

John C Munson

Thomas G Sosebee

Multiple listlets function as a single master linked list to manage data packets across one or more banks of memory in a first-in first-out (FIFO) order, while allowing multiple push and/or pop functions to be performed per cycle. Each listlet can be a linked list that tracks pointers and is stored in a different memory bank. The nodes can include a pointer to a data packet, a pointer to the next node in the listlet and a next listlet identifier that identifies the listlet that contains the next node in the master linked list. The head and tail of each listlet, as well as an identifier each to track the head and tail of the master linked list, can be maintained in cache. The individual listlets are updated accordingly to maintain order of the master linked list as pointers are pushed and popped from the master linked list.

Boosting linked list throughput

A work conserving scheduler can be implemented based on a ranking system to provide the scalability of time stamps while avoiding the fast search associated with a traditional time stamp implementation. Each queue can be assigned a time stamp that is initially set to zero. The time stamp for a queue can be incremented each time a data packet from the queue is processed. To provide varying weights to the different queues, the time stamp for the queues can be incremented at varying rates. The data packets can be processed from the queues based on the tier rank order of the queues as determined from the time stamp associated with each queue. To increase the speed at which the ranking is determined, the ranking can be calculate from a subset of the bits defining the time stamp rather than the entire bit set.

Work conserving scheduler based on ranking

Work conserving schedular based on ranking

A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

Method and device for wafer scale packaging of optical devices using a scribe and break process

A network device for processing data includes at least one ingress module for performing switching functions on incoming data, a memory management unit for storing the incoming data and at least one egress module for transmitting the incoming data to at least one egress port. The at least one egress module includes an egress scheduling module and multiple queues per each of the at least one egress port. Each of the multiple queues serve data attributable to a class of service, and the egress scheduling module is configured to service a minimum bandwidth requirement for each of the multiple queues and then to service the multiple queues to allow for transmission of a maximum allowable bandwidth through a weighting of each of the multiple queues.

Scheduling of data transmission with minimum and maximum shaping of flows in a network device

The present invention is directed to a network device, method and apparatus for processing data. The present invention includes at least one ingress module for performing switching functions on incoming data. The invention further includes a memory management unit (MMU) for storing the incoming data, and at least one egress module for transmitting the incoming data to at least one egress port. Further, in the present invention, the memory management unit further comprises a cell copy count pool (CCP) memory, wherein the CCP determines when a memory cell can be made available.

Cell copy count

Cell copy count hazard detection

A spatial light modulator is fabricated by bonding a capping layer over a wafer bearing active reflecting surfaces utilizing a low temperature bonding agent capable of providing a hermetic seal, such as a glass frit. The low temperature bonding agent may be B-stage cured after application to the capping layer, prior to any exposure to the substrate bearing the reflecting surfaces. In accordance with one embodiment of the present invention, the capping layer may comprise a glass wafer pre-bonded with an interposer spacer layer to provide sufficient stand-off between the capping layer and the underlying reflecting structures. In accordance with an alternative embodiment of the present invention, the capping layer may comprise a glass wafer alone, and the bonding agent may include additional materials such as beads or balls to provide the necessary stand-off between the capping layer and the underlying reflective structures.

Low temperature hermetic bonding at water level and method of bonding for micro display application

Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an, electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or &ldquo;dam&rdquo; over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packing density of devices on the circuit board.

Surface mounted device with grooves on a termination lead

Disclosed is a method for stacking semiconductor chips, including positioning a first chip and manipulating a second chip to a distance above the first chip that is no greater than a selected distance, and releasing the second chip to drop into a stacked configuration on the first chip. The selected distance is such as to avoid damage to either of the chips. Embodiments are disclosed for setting the drop distance of the second chip within the selected distance.

Method and apparatus for stacking IC devices

A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an electronic device. An adhesive applying device, such as a screen printer, applies adhesive to the backside of each circuit component. The circuit components may then be transferred onto a substrate by the use of a piston transfer device, for instance. Preferably, all the circuit components are transferred substantially simultaneously.

Growing community of inventors

Tigard, OR, United States of America

Philip H Chen