Xerox Corporation

Philip G Perry

William G Herbert

Gene W O'Dell

Jin Wu

John F Yanus

Liang-Bih Lin

Geoffrey M T Foley

Nancy Lynn Belknap

Robert P Altavela

David M Skinner

Yonn K Rasmussen

Andronique Ioannidis

Jennifer Y Hwang

Kendra Michele Giza

Alexandra I Vidal

Kenneth J Pheilshifter

Santokh Singh Badesha

Damodar M Pai

Satchidanand Mishra

Robert C U Yu

Huoy-Jen Yuh

Geoffrey M Foley

Gary J Maier

Merlin E Scharfe

Charles J Urso, Iii

Loren E Hendrix

Robert W Nolley

Alexander A Antonelli

Warren F Brydges

Paul Cherin

Catherine N Byers

John M Magde, Jr

James E McNamara

Dominic J Angelini

Linnette Perales Rivera

Gregory J Arserio

Jodie L Morris

Rajiv S Agarwala

Cornelius Boerman

Alexandra I Marcu

Carmen W Enos

An electrophotographic photoreceptor and method for forming a photoreceptor is disclosed which is provided with an anticorrosion layer on the interface between the supporting substrate surface and the undercoat layer. The photoreceptor has a high mechanical strength and minimizes defects in print for longer periods of time.

Photoreceptor member

An electrophotographic photoreceptor is disclosed which is provided with an anti-corrosion layer on the interface between the substrate surface and hole blocking layer. The photoreceptor has high mechanical strength and minimizes defects in print for longer periods of time.

The present disclosure provides photoreceptors and methods for fabricating photoreceptors. Photoreceptor device surfaces and fabrication methods have been designed to suppress a 'plywood effect.' One method includes providing a substrate, rotating the substrate, lathing the substrate with a cutting tool and a cutting fluid by at least one pass, cleaning the substrate to remove the cutting fluid, and depositing onto the substrate at least one layer.

Substrate with plywood suppression

An apparatus including: (a) a substrate including a deposition region and an optional uncoated region, wherein the deposition region includes a level intermediate region disposed between a first end region and a second end region, wherein the first end region includes a first recessed surface portion that increases the surface area of the first end region, wherein the first recessed surface portion is recessed below the level intermediate region, wherein the surface area of the first end region is greater by at least about 5% than the surface area of a hypothetical level first end region; and (b) a dip coated layer over the entire deposition region.

Substrate with recessed surface portion

A process for preparing an imaging member includes applying an organic layer to an imaging member substrate, treating the organic layer and/or a backside of the substrate with a corona discharge effluent, and applying an overcoating layer to the organic layer and/or an anticurl backing layer to the backside of the substrate.

Enhancing adhesion of organic electrostatographic imaging member overcoat and anticurl backing layers

A process including providing a member having an exposed outer metal surface and propelling irregularly shaped solid carbon dioxide granules against the exposed outer metal surface with sufficient force to alter the texture of the outer metal surface to a predetermined surface roughness.

Process for roughening a surface

A honing means produces sonic waves that suspend and propel a honing medium against a surface of a substrate. The honing medium impinges on the surface of the substrate and alters the substrate's surface roughness. The substrate and the honing means are positioned relative to each other to ensure substantial surface roughness uniformity.

Sonic honing of substrates

There is disclosed a method for depositing layered material onto a substrate including a layer formed from a coating solution, wherein the method comprises: (a) cleaning the substrate by dipping the substrate into and raising the substrate from a cleaning solvent selected from the group consisting of (i) a mixture comprising an alcohol and an alkane; and (ii) a liquid compatible with the coating solution; and (b) dipping the substrate subsequent to (a) into and raising the substrate from the coating solution, thereby depositing the layer on the substrate, wherein when the cleaning solvent is the liquid compatible with the coating solution, any cleaning solvent present on the substrate upon the dipping of the substrate into the coating solution fails to detrimentally affect the layer.

Coating method involving substrate cleaning

A photoreceptor fabrication method involving a photoreceptor substrate having a metal surface, comprising etching the metal surface of the photoreceptor substrate with an etching solution and forming a metal oxide layer on the metal surface with the etching solution, wherein the etching of the metal surface and the forming of the metal oxide layer are conducted in the absence of an electric current.

Photoreceptor fabrication method

There is disclosed a process for forming a photosensitive imaging member including positioning a substrate and an electrode in an electrolytic solution to form a galvanic cell and electrochemically graining the substrate surface in the absence of an external power source to provide a substrate surface roughness sufficient to substantially suppress the formation of a pattern of light and dark interference fringes upon exposure of the photosensitive imaging member to a light source.

Surface treatment method without external power source

A photoreceptor fabrication method composed of spraying a honing composition including particulate material against a substrate in a particulate material spray distribution containing only one peak in a graph of the number of particulate material versus distance along the spray area to create a predetermined surface roughness.

Substrate honing method

There is disclosed a method for surface treating a substrate used in a photosensitive imaging member including: (a) impinging a honing composition comprised of particulate material against the substrate surface to create a surface roughness sufficient to substantially suppress formation of a pattern of light and dark interference fringes upon exposure of the photosensitive imaging member, wherein the particulate material is capable of being dissolved by a solvent; and (b) rinsing the substrate surface having the surface roughness with a cleansing composition comprised of the solvent, wherein any particulate material remaining on the substrate surface having the surface roughness is dissolved by the solvent.

Substrate treatment method using soluble particles

A cleaning solution for cleaning substrates such as imaging member substrates includes a weak acid, borax or a polyphosphate, an oil-soluble surfactant, and a water-soluble surfactant such as a water-soluble polysorbate, a polyethylene/polypropylene copolymer or a mixture thereof. The cleaning solution increases the cleaning capability of a corresponding cleaning process, and also improves the efficiency of the cleaning process by avoiding the necessity of neutralization and waste treatment operations.

Cleaning process for photoreceptor substrates

There is disclosed an electrostatographic imaging member comprising: (a) a substrate; (b) a charge blocking layer comprised of nickel hydroxide and nickel oxide, wherein the nickel hydroxide content is at least about 10% based on the number of the nickel hydroxide and the nickel oxide molecules; and (c) a least one imaging layer.

Imaging member including a blocking layer containing an enriched amount

A xeroradiographic imaging member containing a substrate having an electrically conductive surface, an electroradiographic insulating layer selected from the group consisting of selenium and selenium alloys, and an overcoating layer containing nigrosene, a charge transport compound and a copolyester resin represented by the following formula: ##STR1## wherein the diacid is selected from the group consisting of terephthalic acid, isophthalic acid, and mixtures thereof, the diol comprises ethylene glycol, the mole ratio of the diacid to the diol is about 1:1, n is a number between about 175 and about 350 and the T.sub.g of the copolyester resin is between about 50.degree. C. about 80.degree. C.

Growing community of inventors

Webster, NY, United States of America

Philip G Perry