Other

Sundstrand Corporation

Advanced Angioplasty Products, Inc.

Philip Eugene Eggers

Robert F Shaw

Hira V Thapliyal

Raymond George McCready

This invention provides a method and apparatus for selectively heating an atheromatous mass which partially or fully occludes a particular blood vessel. As a result, the occlusive mass is effectively softened or weakened, allowing the occlusive mass to be more readily recanalized by expansion of a balloon or other dilitation means. This invention also provides a method and apparatus for effectively boring through a partially or fully occluded blood vessel by simultaneously applying both (1) heat to the occlusive mass surrounding the tip of the catheter and (2) pressure against the mass within the partially or fully occluded blood vessel.

Thermal angioplasty catheter and method

Method and means are disclosed for preventing tissue from adhering to surgical apparatus while operating at tissue temperatures at which hemostasis with minimal tissue damage occurs, and include interposing between the surgical apparatus and the tissue being heated thereby an abherent coating which exhibits electrical insulation and thermal impedance, thickness and thermal drop thereacross within specified limits.

Abherent surgical instrument and method

A thermodilution catheter has electrodes in electrical contact with the blood flowing adjacent to the catheter. A potential difference applied to the electrodes causes electrical current to flow in the volume of blood in the region of the electrodes, thereby creating a bolus of blood at elevated temperature suitable for measurement of blood flow by the thermodilution principle.

Methods and apparatus for performing in vivo blood thermodilution

In order to remove heat from integrated circuit modules a layered aluminum heat transfer structure is secured to the upper portion of a circuit board. The heat transfer structure includes a number of heat pipes for transferring heat to a condenser region. Each heat pipe is composed of a central vapor channel with a number of parallel capillary channels, each of which is open on one side to the vapor channel thereby serving as the wick of the heat pipe, running the length of the circuit board to a condenser region. There is one heat pipe for each row of integrated circuit modules wherein the modules are placed on the upper portion of the heat transfer structure and secured by means of terminal pins that run through the structure to the circuit board. The heat from the circuit modules vaporizes a working fluid in the capillaries and the vapor, in turn, travels in the vapor channel to a condenser region to be cooled and condensed by a cooling medium over this region.

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Worthington, OH, United States of America

Philip Eugene Eggers