The Dow Chemical Company

Research Triangle Institute

Dow Global Technolgoies LLC

Siluria Technologies, Inc.

Semprius, Inc.

Philip E Garrou

George E Hartwell

Iwao Kohatsu

Christopher Andrew Bower

Clayton D Wood

Jere D Fellmann

Kaoru Ohba

Charles Kenneth Williams

Ying-Hung So

Edward F Gleason

Britton Lee Kaliszewski

Hideki Akimoto

Matthew Alexander Meitl

Etienne Menard

Florian Pschenitzka

Michael R Knapp

Michael A Spaid

Xina Quan

Dietmar Seyferth

Hash Pakbaz

Lawrence G Duquette

Robert A Dubois

Gary R Strickler

Chu W Jung

Bart J Bremmer

Kuo Y Chang

Brian B Martin

Albert Charles Marie Achen

Howard P Withers, Jr

Edward F Gleason, Iii

An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

Electrically bonded arrays of transfer printed active components

A method for making a structure for thermal management of circuit devices. The method provides a first substrate and a second substrate where at least one of the first and second substrates includes a circuit element. The method forms in at least one of the first substrate and the second substrate an entrance through-hole extending through a thickness of the first substrate or the second substrate, forms in at least one of the first substrate and the second substrate an exit through-hole extending through a thickness of the first substrate or the second substrate, forms respective bonding elements on at least one of the first and second substrates, and bonds the first and second substrates at the respective bonding elements to form a seal between the first and second substrates and to form a first coolant channel in between the first and second substrates.

Structure and process for electrical interconnect and thermal management

A structure and method for thermal management of integrated circuits. The structure for thermal management of integrated circuits includes first and second substrates bonded together, at least one of the first and second substrates including at least one circuit element, an entrance through-hole having a length extending through a thickness of at least one of the first substrate and the second substrate, an exit through-hole having a length extending through a thickness of at least one of the first substrate and the second substrate, a bonding element forming a seal between the first and second substrates and forming a space between the first and second substrate, and a coolant channel formed in the space between the first and second substrates such that a fluid entering the entrance through-hole transits the coolant channel and the exit through-hole to provide cooling to the circuit element. The method supplies a fluid through the entrance through-hole, flows the fluid through the coolant channel between the first substrate and second substrates, and removes the fluid from the coolant channel through the exit through-hole.

Improved methods and articles providing conformal coatings for a variety of devices including electronic, semiconductor, and liquid crystal display devices. Peptide formulations which bind to nanoparticles and substrates, including substrates with trenches and vias, to provide conformal coverage as a seed layer. The seed layer can be further enhanced with use of metallic films deposited on the seed layer. Seed layers can be characterized by AFM measurements and improved seed layers provide for better enhancement layers including lower resistivity in the enhancement layer. Peptides can be identified by phage display.

Printable electric circuits, electronic components and method of forming the same

The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.

Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards

High molecular weight polyethylene glycol monoethers are cleaved to prepare lower oligomeric reaction products by contacting a mixture of the high molecular weight polyethylene glycol monoether and water with a hydrolytic cleavage catalyst such as alumina at elevated temperatures.

Cleavage of polyethylene glycol ethers by hydrolysis

A catalyst composition comprising a catalytic metal and a support, the support being prepared by depositing a metal alkoxide on a core support, then calcining the support.

Catalysts having alkoxide-modified supports and method of increasing the

Novel compositions of matter comprising Group VIII metal chelates of linear ferrocenyl phosphines, arsines or stibines. The complexes are useful recoverable hydroformylation catalysts.

Metal chelates of polymeric ferrocenes

A catalytic process for the disproportionation of alkenes in a distillation column reactor, whereby high conversion and selectivity are simultaneously achieved.

Disproportionation of alkenes

The invention is the process which comprises contacting a reaction mixture comprising between about 1 and 100 percent by weight of a polyethylene-substituted piperazine, a piperazine or mixtures thereof, wherein such compounds contain a primary or secondary nitrogen wherein one of the carbons adjacent to the nitrogen has a hydrogen atom bonded to the carbon atom, and between about 1 and 99 percent of a solvent, with a catalytic amount of palladium on a support, at a temperature of between about 150.degree. C. and 300.degree. C., under condition such that the product so prepared contains polyethylene polypiperazines.

Polyethylene polypiperazine compositions

A catalyst composition comprising a catalytic metal and a support, the support being prepared by depositing a metal alkoxide salt on a core support, then calcining the support.

Catalysts having alkoxide-modified supports

Novel linear polymers of ferrocene are prepared by the reaction of 1,1'-dilithioferrocene with controlled amounts of a dihaloorganylphosphine, arsine or stibine. The polymers form stable complexes with Group VIII metals which are useful as recoverable hydroformylation catalysts.

Polymers of ferrocene

Acrolein acetals are selectively hydroformylated on the unsaturated carbon atom adjacent to the carbon bearing two ether groups in the presence of a supported rhodium-cobalt bimetallic cluster. The resulting internally hydroformylated product is useful as a precursor of methacrylic acid.

Growing community of inventors

Holliston, MA, United States of America

Philip E Garrou