Freescale Semiconductor,inc.

Philip E Crabtree

Kurt H Junker

Gregory S Spencer

Dean J Denning

Gerald A Martin

A method for making a semiconductor device comprises forming an electrical interconnect layer, forming a first dielectric layer over the interconnect layer, forming an opening in the first dielectric layer over a first electrical interconnect of the interconnect layer, forming an aluminum layer over the first dielectric layer, etching the aluminum layer to form an aluminum die pad, forming a second dielectric layer over the aluminum die pad and the first dielectric layer, and forming a conductive via through the first and second dielectric layers to contact a second electrical interconnect of the interconnect layer.

Growing community of inventors

Austin, TX, United States of America

Philip E Crabtree