Qualcomm Mems Technologies, Inc.

Idc, LLC

Qualcomm Incorporated

Philip Don Floyd

Brian W Arbuckle

Brian James Gally

Jeffrey Brian Sampsell

William J Cummings

Ming-Hau Tung

Lauren Palmateer

Wen-Jian Lin

David Leslie Heald

Clarence Chui

Mark W Miles

Evgeni Petrovich Gousev

Marc Mignard

Teruo Sasagawa

Fan Zhong

Khurshid Syed Alam

Wilhelmus Adrianus De Groot

Yair Karmi

Ana Rangelova Londergan

Chok Ho

Xiaoming Yan

Eric J Worthington

A method of presenting multiple frames on a touch screen is disclosed. In a particular embodiment, the method includes detecting multiple touch locations on a touch screen of an electronic device for at least an activation time. The method also includes splitting a display area of the touch screen into a first frame and a second frame based on the multiple touch locations.

Systems and methods to present multiple frames on a touch screen

Methods of fabricating an electromechanical systems (EMS) device with spacers between plates and EMS devices formed by the same are disclosed. In one embodiment, a EMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier may be released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the EMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The resulting EMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

Methods of fabricating MEMS with spacers between plates and devices formed by same

An array of MEMS shutters may incorporate opaque and/or interference-based film stacks, to control light in a window. The shutter structure may include one or more layers with a controlled stress gradient, which makes a shutter arm curl out of plane and away from a defined aperture for light, thus permitting light to be transmitted through a transparent substrate and past the MEMS structure. To close the shutter, a voltage may be applied between an electrode in the shutter arm and an electrode covering a region on the substrate, rolling the shutter arm flat against the substrate electrode and placing the shutter arm over the aperture. The shutter arm may be configured to transmit selected wavelengths of light. In some implementations, the shutter arm may be configured to filter out infrared light.

Switchable windows with MEMS shutters

Etching equipment and methods are disclosed herein for more efficient etching of sacrificial material from between permanent MEMS structures. An etching head includes an elongate etchant inlet structure, which may be slot-shaped or an elongate distribution of inlet holes. A substrate is supported in proximity to the etching head in a manner that defines a flow path substantially parallel to the substrate face, and permits relative motion for the etching head to scan across the substrate.

Equipment and methods for etching of MEMS

A voltage-controlled capacitor and methods for forming the same are described. A mechanical conductor membrane of the voltage-controlled capacitor is movable to and from a first position and a second position. An amount of capacitance can vary with the movement of the mechanical conductor membrane. A microelectromechanical systems (MEMS) voltage-controlled capacitor can be used in a variety of applications, such as, but not limited to, RF switches and RF attenuators.

Selectable capacitance circuit

The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process.

Etching processes used in MEMS production

Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.

Method and system for packaging a display

Various embodiments of the invention relate to methods and systems for generating the color white in displays created from interferometric modulators and more specifically, to the generation of the color white through the use of reflected light at two wavelengths. In one embodiment, a display device displays the color white. The color white is generated by reflecting light from two pluralities of interferometric modulator types. The first modulator type reflects colored light at a specific wavelength. The second modulator type reflects colored light selected to be at a wavelength complementary to the first. The combined light reflected from the two types appears white in the display.

Method and device for generating white in an interferometric modulator display

Disclosed is a microelectromechanical system (MEMS) device and method of manufacturing the same. In one aspect, MEMS such as an interferometric modulator include one or more elongated interior posts and support rails supporting a deformable reflective layer, where the elongated interior posts are entirely within an interferometric cavity and aligned parallel with the support rails. In another aspect, the interferometric modulator includes one or more elongated etch release holes formed in the deformable reflective layer and aligned parallel with channels formed in the deformable reflective layer defining parallel strips of the deformable reflective layer.

MEMS devices having improved uniformity and methods for making them

A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

Optical interference display panel and manufacturing method thereof

A MEMS device such as an interferometric modulator includes an integrated ESD protection element capable of shunting to ground an excess current carried by an electrical conductor in the MEMS device. The protection element may be a diode and may be formed by depositing a plurality of doped semiconductor layers over the substrate on which the MEMS device is formed.

Method and device for protecting interferometric modulators from electrostatic discharge

A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Apparatus and method for reducing slippage between structures in an interferometric modulator

A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described. The MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method may include forming a metal seal on the substrate proximate to a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.

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Redwood City, CA, United States of America

Philip Don Floyd