Shipley Company LLC

Rohm & Haas Electronic Materials LLC

Rohm and Haas Electronics Materials LLC

Philip D Knudsen

Charles R Shipley

Daniel Y Pai

James G Shelnut

Jensheng Chen

Maria Anna Rzeznik

Martin William Bayes

Matthew L Moynihan

Edgardo Anzures

Nicola Pugliano

James E Rychwalski

Paul J Ciccolo

Hai Bin Zheng

Yuhsin Tsai

Xuesong Wang

Robert B Currie

A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.

Method for electroless metallization

Provided are polymers comprising the condensation product of silicon-containing reactants. Also provided are compositions suitable for use in forming optical waveguides which include such polymers, as well as optical waveguides formed from such polymers. The polymers, compositions and optical waveguides have particular use in the formation of printed wiring boards having electrical and optical functionality.

Silicon-containing polymers and polymers and optical waveguides formed therefrom

Provided are methods of forming a printed circuit board having optical functionality. The methods involve: (a) providing a first, printed circuit board substrate; (b) forming an optical waveguide structure comprising a clad and a core structure on a second substrate separate from the printed circuit board substrate, wherein the optical waveguide structure comprises a silicon-containing material; (c) separating the optical waveguide structure from the second substrate; and (d) affixing the optical waveguide structure to the printed circuit board substrate. The invention has particular applicability in the electronics and optoelectronics industries for the formation of hybrid printed circuit boards.

Methods of forming printed circuit boards

Provided are methods of forming printed circuit boards having optical functionality. The methods involve applying a dry-film to a printed circuit board substrate and forming an optical waveguide over the dry-film. The invention finds particular applicability in the electronics and optoelectronics industries.

Methods of forming printed circuit boards having optical functionality

Radiation sensitive compositions, processes for using the compositions, and articles of manufacture comprising the compositions. The photoimageable compositions of the invention comprises a radiation sensitive component, a resin binder and a polybutadiene that comprises one or more internal epoxide groups. In preferred aspects, the compositions of the invention further comprise a crosslinking agent such as a melamine or an epoxidized material, or mixtures thereof.

Process of making flexible circuits and imaged coatings

A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.

Conditioning process for electroless plating of polyetherimides

Photoimageable compositions comprising polybutadiene having internal

Radiation sensitive compositions

The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.

Coating composition

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Northboro, MA, United States of America

Philip D Knudsen