Kla-tencor Technologies Corporation

Kla Tencor Corporation

Tencor Instruments

Kla-tenor Corp.

Philip D Flanner, Iii

Leonid Poslavsky

Paul Aoyagi

Xiang Gao

Qiang Zhao

Hanyou Chu

Torsten Rudolf Kaack

Ming Di

Peilin Jiang

Xing Chen

Mikhail M Sushchik

Jonathan Iloreta

Zhiming Jiang

Jennming Chen

Kiron B Malwankar

Scott Penner

Jeffrey Chard

Jun-Jie Ye

Methods and systems of process control and yield management for semiconductor device manufacturing based on predictions of final device performance are presented herein. Estimated device performance metric values are calculated based on one or more device performance models that link parameter values capable of measurement during process to final device performance metrics. In some examples, an estimated value of a device performance metric is based on at least one structural characteristic and at least one band structure characteristic of an unfinished, multi-layer wafer. In some examples, a prediction of whether a device under process will fail a final device performance test is based on the difference between an estimated value of a final device performance metric and a specified value. In some examples, an adjustment in one or more subsequent process steps is determined based at least in part on the difference.

Calculated electrical performance metrics for process monitoring and yield management

Provided are optimized scatterometry techniques for evaluating a diffracting structure. In one embodiment, a method includes computing a finite-difference derivative of a field matrix with respect to first parameters (including a geometric parameter of the diffracting structure), computing an analytic derivative of the Jones matrix with respect to the field matrix, computing a derivative of the Jones matrix with respect to the first parameters, and computing a finite-difference derivative of the Jones matrix with respect to second parameters (including a non-geometric parameter). In one embodiment, a method includes generating a transfer matrix having Taylor Series approximations for elements, and decomposing the field matrix into two or more smaller matrices based on symmetry between the incident light and the diffracting structure.

Techniques for optimized scatterometry

Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical dispersion metrics are determined based on the spectral data. Band structure characteristics such as band gap, band edge, and defects are determined based on optical dispersion metric values. In some embodiments a band structure characteristic is determined by curve fitting and interpolation of dispersion metric values. In some other embodiments, band structure characteristics are determined by regression of a selected dispersion model. In some examples, band structure characteristics indicative of band broadening of high-k dielectric films are also determined. The electrical performance of finished wafers is estimated based on the band structure characteristics identified early in the manufacturing process.

High throughput thin film characterization and defect detection

A method of determining actual properties of layered media. An incident beam of light is directed towards the layered media, such that the incident beam of light is reflected from the layered media as a reflected beam of light. The actual properties of the reflected beam of light are measured, and properties of the layered media are estimated. A mathematical model of the layered media is solved with the estimated properties of the layered media to yield theoretical properties of the reflected beam of light. The mathematical model is solved using a diagonal T matrix algorithm. The theoretical properties of the reflected beam of light are compared to the actual properties of the reflected beam of light to yield a cost function. The estimated properties of the layered media are iteratively adjusted and the mathematical model is iteratively solved until the cost function is within a desired tolerance. The estimated properties of the layered media are reported as the actual properties of the layered media.

Film measurement using reflectance computation

A method of determining actual properties of layered media. An incident beam of light is directed towards the layered media, such that the incident beam of light is reflected from the layered media as a reflected beam of light. The actual properties of the reflected beam of light are measured, and properties of the layered media are estimated. A mathematical model of the layered media is solved with the estimated properties of the layered media to yield theoretical properties of the reflected beam of light. The mathematical model is solved using at least one of a modified T matrix algorithm and a Z matrix algorithm. The theoretical properties of the reflected beam of light are compared to the actual properties of the reflected beam of light to yield a cost function. The estimated properties of the layered media are iteratively adjusted and the mathematical model is iteratively solved until the cost function is within a desired tolerance. The estimated properties of the layered media are reported as the actual properties of the layered media.

Film measurement

A method of determining the actual properties of a film stack. An incident beam of light is directed towards the film stack, such that the incident beam of light is reflected from the film stack as a reflected beam of light. The actual properties of the reflected beam of light are measured, and properties of the film stack are estimated. A mathematical model of the film stack is solved with the estimated properties of the film stack to yield theoretical properties of the reflected beam of light. The theoretical properties of the reflected beam of light are compared to the actual properties of the reflected beam of light to yield a cost function. The estimated properties of the film stack are iteratively adjusted and the mathematical model is iteratively solved until the cost function is within a desired tolerance. The estimated properties of the film stack are reported as the actual properties of the film stack. A method based on analytical derivatives, and not numerically computed derivatives, of solutions to Maxwell's equations that are at least partially expressible as complex exponential matrices is used to iteratively adjust the estimated properties of the film stack.

A method for calibrating an ellipsometer, and an ellipsometer including a processor programmed to control the analyzer, polarizer, and other ellipsometer components, and to process the data measured by the ellipsometer to perform the calibration method automatically. Where the ellipsometer's polarizer rotates and the analyzer remains fixed during measurement, the method determines coarse approximations of values A.sub.0 and P.sub.0, and then processes reflectivity data obtained at two or more analyzer angles to determine refined approximations of the values A.sub.0 and P.sub.0, where P.sub.0 is the angle of the polarizer's optical axis at an initial time, and A.sub.0 is the offset of the actual orientation angle of the analyzer from a nominal analyzer angle. Preferably the ellipsometer is a spectroscopic ellipsometer, the reflectivity data determine a tan.psi. spectrum and a cos.DELTA. spectrum for each of the analyzer angles, and the coarse approximations of A.sub.0 and P.sub.0 are refined by processing the reflectivity data by performing regression on A.sub.0 and P.sub.0 until the differences among the tan.psi. and cos.DELTA. spectra for several analyzer angles are minimized. Where the ellipsometer's analyzer rotates and the polarizer remains fixed during measurement, the method coarsely determines values A'.sub.0 and P'.sub.0, and then processes reflectivity data obtained at two or more polarizer angles to determine refined approximations of the values A'.sub.0 and P'.sub.0, where P'.sub.0 is the angle of the analyzer's optical axis at an initial time, and A'.sub.0 is the offset of the actual orientation angle of the polarizer from a nominal polarizer angle.

Method and system for calibrating an ellipsometer

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Union City, CA, United States of America

Philip D Flanner, Iii