Aavid Engineering, Inc.

Philip A Johnson

Alfred F McCarthy

Dissipation of heat from a socketed leadless electronic chip-carrier package is promoted by a heat-conducting metal socket cap distinctively overlying and guiding heat away from the socketed package fully along a broad planar surface area, the socket cap being of a unitary construction which both mechanically holds the package securely mated with a multi-pin socket and also cools the package by way of an integrated array of heat-radiating elements; edge clasping of the cap with a chip-carrying socket avoids interference with needed conduction of heat away from central areas of the package and cap.

Electronic chip-carrier heat sinks

Pinned heat-sink extrusion for circuit-board mounting

In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelepiped body, an elongated sheet-metal strip of heat-radiating elements disposed above and in spaced relation to the top of the package has its opposite ends integrally connected with separate spaced heat-conducting clip members which are cantilevered from it in different directions to fit respectively about the top and bottom surfaces of the package and to flex so as to accommodate insertion of the package between them and yet adjust themselves into desirable broad-area abutments with those surfaces. Heat conducted away from the package by each of the cantilevered members first reaches a different end of the strip of heat-radiating elements, without coursing through the other member and without interfering with the heat-exchange taking place along the opposite surfaces of the package clipped between the members.

Heat sinks for integrated circuit modules

Self-fastened heat sink

Auxiliary heat-sink attachments which promote dissipation of heat from electronic solid-state devices and the like are secured with such devices and with associated printed-circuit boards by way of accessory fastenings with which they form a sub-assembly wave-solderable in pre-spaced relation to the board.

Heat sink fastenings

Flanged-collar heat sink for electronic devices

Self-fastened heat sink for electronic devices

Dissipation of heat from miniature solid-state devices and the like is achieved by a resilient heat-sink structure which opens to receive a tab or other heat-transfer body freely between two relatively-movable oppositely-disposed broad-area portions of the structure and which then closes and yieldingly holds the two portions about the body as shaped end connectors are sprung and locked as the result of simple manipulations.

Self-fastened heat sinks

Dissipation of heat from miniature solid-state devices and the like is achieved by a resilient heat-sink structure which opens to receive a substantially flat tab or other heat-transfer body freely between two relatively-movable oppositely-disposed broad-area portions of the structure and which then closes and yieldingly holds the two portions about the body as shaped end connectors and sprung and locked as the result of simple manipulations.

Growing community of inventors

Melrose, MA, United States of America

Philip A Johnson