Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Avago Technologies Wireless IP (singapore) Pte. Ltd.

Phil Nikkel

John Choy

Dariusz Burak

Chris Feng

Kevin J Grannen

Alexandre Shirakawa

Stefan Bader

Tina L Lamers

Tangshiun Yeh

John Dwight Larson, Iii

Jyrki Kaitila

Robert Thalhammer

Qiang Zou

Thomas Edward Dungan

Martin Handtmann

David Martin

Rick Snyder

Kristina Lamers

Steve Gilbert

Thomas Faust

Sook Ching Chang

Tom Yeh

An acoustic resonator is disclosed. The acoustic resonator comprises a substrate, a first electrode, a second electrode and a piezoelectric layer positioned between the first electrode and the second electrode. An acoustic reflector is positioned between the first electrode and the substrate. An active area comprises a region of contacting overlap of the acoustic reflector, the first electrode, the piezoelectric layer and the second electrode. A gap region extends around the active area.

Acoustic resonator structure having an electrode with a cantilevered portion

A bulk acoustic wave (BAW) resonator includes: a substrate; an acoustic reflector disposed in the substrate; a first electrode disposed over the acoustic reflector; a second electrode; and a piezoelectric layer between the first and second electrodes. The second electrode is not disposed between the first electrode and the acoustic reflector. The BAW resonator further includes a block disposed over the substrate and beneath the piezoelectric layer. A contacting overlap of the acoustic reflector, the first electrode, the second electrode and the piezoelectric layer defines an active area of the BAW resonator.

Bulk acoustic wave resonator

An acoustic resonator comprises a first electrode and second electrode comprising a plurality of sides. At least one of the sides of the second electrode comprises a cantilevered portion. A piezoelectric layer is disposed between the first and second electrodes. A bridge disposed adjacent to one of the sides of the second electrode.

A bulk acoustic wave (BAW) resonator device includes a bottom electrode on a substrate over one of a cavity and an acoustic mirror, a piezoelectric layer on the bottom electrode, a top electrode on the piezoelectric layer, and a temperature compensation feature having positive temperature coefficient for offsetting at least a portion of a negative temperature coefficient of the piezoelectric layer. At least one of the bottom electrode and the top electrode includes an integrated lateral feature configured to create at least one of a cut-off frequency mismatch and an acoustic impedance mismatch.

Acoustic resonator having integrated lateral feature and temperature compensation feature

A bulk acoustic wave (BAW) resonator having a first electrode, a second electrode, and a piezoelectric layer between the first electrode and the second electrode. The first electrode is of a first electrode material. The second electrode is of a second electrode material. The piezoelectric layer is of a piezoelectric material doped with at least one rare earth element. The BAW resonator has a resonant frequency dependent at least in part on respective thicknesses and materials of the first electrode, the second electrode and the piezoelectric layer. The resonant frequency has a temperature coefficient. At least one of the first electrode and the second electrode includes a niobium alloy electrode material that, relative to molybdenum as the electrode material, reduces the temperature coefficient of the resonant frequency of the BAW resonator.

Bulk acoustic wave devices with temperature-compensating niobium alloy electrodes

An acoustic resonator device includes a bottom electrode disposed on a substrate over an air cavity, a piezoelectric layer disposed on the bottom electrode, and a top electrode disposed on the piezoelectric layer, where an overlap between the top electrode, the piezoelectric layer and the bottom electrode over the air cavity defines a main membrane region. The acoustic resonator device further includes at least one metal frame disposed on a bottom surface of the bottom electrode having a thickness that ranges from about 10% to about 75% of a thickness of the bottom electrode in a central region of the bottom electrode. The thickness of the metal frame improves heat dissipation out of the acoustic resonator device while also improving structural stability of the acoustic resonator device without detrimentally affecting its performance.

Acoustic resonator device with at least one air-ring and frame

A bulk acoustic wave (BAW) resonator comprises: a first electrode; a second electrode comprising a plurality of sides, wherein at least one of the sides is a connection side; a piezoelectric layer disposed between the first and second electrodes, and an acoustic reflective element disposed beneath the first electrode, the second electrode and the piezoelectric layer, wherein an overlap of the reflective element, the first electrode, the second electrode, and the piezoelectric layer defines an active area of the acoustic resonator; a bridge adjacent to a termination of the active area of the BAW resonator; and a discontinuity disposed in the bridge.

Bulk acoustic wave (BAW) resonator structure

An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer, and an air cavity disposed in the substrate below at least a portion of a main membrane region defined by an overlap between the first electrode. The acoustic resonator structure may further comprise various integrated structures at or around the main membrane region to improve its electrical performance.

Acoustic resonator comprising integrated structures for improved performance

A method is provided for fabricating a bulk acoustic wave (BAW) resonator device. The method includes forming an etch stop layer over a bottom electrode and a substrate; forming a dielectric layer on the etch stop layer; forming a photomask over the dielectric layer defining an opening over the bottom electrode; etching a portion the dielectric layer through the opening of the photomask to the etch stop layer to create a corresponding opening in the dielectric layer; removing the photomask, leaving un-etched protruding portions of the dielectric layer around the opening in the dielectric layer; and removing the protruding portions of the dielectric layer, a portion of the etch stop layer located over the bottom electrode, and a minimal portion of the bottom electrode to provide a planarized surface including a top surface of the bottom electrode and an adjacent top surface of the dielectric layer deposited over the substrate.

Method of fabricating acoustic resonator with planarization layer

A solid mount bulk acoustic wave resonator, comprises a first electrode; a second electrode; a piezoelectric layer disposed between the first and second electrodes; and an acoustic reflector comprising a plurality of layers and disposed beneath the first electrode, the second electrode and the piezoelectric layer. An overlap of the acoustic reflector, the first electrode, the second electrode and the piezoelectric layer defines an active area of the acoustic resonator, and the piezoelectric layer extends over an edge of the first electrode. The acoustic resonator also comprises a bridge adjacent to a termination of the active area of the acoustic resonator. The bridge overlaps a portion of the first electrode.

Solid mount bulk acoustic wave resonator structure comprising a bridge

A bulk acoustic wave (BAW) resonator includes a bottom electrode disposed on a substrate, a piezoelectric layer disposed over the bottom electrode, and a top electrode disposed over the piezoelectric layer. The BAW resonator further includes at least one air-gap and corresponding support structure, where the at least one air-gap separates at least one of the bottom electrode and the top electrode from the piezoelectric layer, respectively.

Capacitive coupled resonator device with air-gap separating electrode and piezoelectric layer

A method of forming an acoustic resonator includes forming a seed layer on a first electrode layer, forming a piezoelectric layer directly on a surface of the seed layer, and forming a second electrode layer on the piezoelectric layer. The piezoelectric layer includes multiple crystals of piezoelectric material, and the seed layer causes crystal axis orientations of the crystals to be substantially perpendicular to the surface of the seed layer.

Method of forming acoustic resonator using intervening seed layer

An acoustic resonator structure comprises a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode and comprising aluminum scandium nitride, a second electrode disposed on the piezoelectric layer, and a temperature compensation feature having a temperature coefficient offsetting at least a portion of a temperature coefficient of the piezoelectric layer, the first electrode, and the second electrode.

Acoustic resonator comprising aluminum scandium nitride and temperature compensation feature

An acoustic resonator device includes a bottom electrode disposed on a substrate over an air cavity, a piezoelectric layer disposed on the bottom electrode, and a top electrode disposed on the piezoelectric layer, where an overlap between the top electrode, the piezoelectric layer and the bottom electrode over the air cavity defines a main membrane region. The acoustic resonator device further includes at least one air-ring defining a boundary of the main membrane region, and at least one first frame formed between the bottom electrode and the piezoelectric layer or formed between the substrate and the bottom electrode, and a second frame formed between the piezoelectric layer and the top electrode.

In a representative embodiment, a bulk acoustic wave (BAW) resonator, comprises: a cavity disposed in a substrate; a first electrode disposed over the cavity; a planarization layer disposed adjacent to the first electrode; a piezoelectric layer disposed over the first electrode; and a second electrode disposed over the piezoelectric layer.

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Loveland, CO, United States of America

Phil Nikkel