Google Inc.

Phanindraja Ancha

Brian Huynh

Jun Hou

Yau-Shing Lee

Patanjali Peri

Yu Wei Chen

Ihab A Ali

Frédéric Heckmann

Robert Jason Rose

Emil Rahim

Myrrhia Rae Resneck

Neha Ravi Dixit

Laura Charlotte Shumaker

Robert Sean Murphy

Robert Brett Rose

Edmond Lu

The present document describes a textile-assembly toolkit for reversible assembly of a textile to an electronic-speaker device. The toolkit includes multiple attachment features, including rigid features with matched purposefully-designed knit types that can be combined to enable repeatable, mass-producible, reversible assembly of the textile to the electronic-speaker device. The techniques described herein enable accurate alignment of the textile on the electronic-speaker device without distorting the textile's cosmetic pattern and in a manner that results in no visible edges of the textile or visible attachment features on the exterior of the electronic-speaker device. Also, the textile-assembly toolkit includes attachment features that secure the textile with sufficient tension to avoid acoustic distortion such as rub and buzz.

Textile-assembly toolkit for reversible assembly of a textile to an electronic-speaker device

The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

Passive thermal-control structure for speakers and associated apparatuses and methods

This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.

Compact speaker device

The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are 'proud' (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

Apparatus for reducing fabric dimpling in electronic devices and associated methods

This application is directed to a compact voice-activated electronic device with speakers and electronic components and a dual waveguide/heatsink structure configured to direct sound from the speakers to the outside of the device and to dissipate to the outside of the device heat from the electronic components.

Compact home assistant with combined acoustic waveguide and heat sink

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San Francisco, CA, United States of America

Phanindraja Ancha