Intel Corporation

Phani Kumar Kandula

Tessil Thomas

Howard Chin

Stefan Rusu

Krishnakanth Venkata Sistla

Linda L Hurd

Eric C Samson

Sandeep Ahuja

Robin A Steinbrecher

David N Lombard

Srikrishnan Venkataraman

Narayanan Natarajan

Gururaj Shamanna

Michael Berktold

Timothy Y Kam

Ahmed Abou-Alfotouh

Mark J Luckeroth

John Kelbert

Brad Bittel

Sankalan Prasad

Mandar R Ranade

Murali Ramadoss

Ankur N Shah

Nikos Kaburlasos

Vivek Garg

Lakshminarayana Pappu

Ian M Steiner

Ramamurthy Krithivas

Bharat S Pillilli

Jayakrishna Guddeti

Eric J Moret

Eric J M Moret

Suresh Chemudupati

Yi-Feng Liu

Junaid Thaliyil

Chandra P Joshi

Pavithra Sampath

Marc Beuchat

Ali Ibrahim

Rodrigo De Oliveira Vivi

A system includes multiple processors and a power controller. Each processor includes a throttling engine. The power controller is to, in response to a determination that a first power consumption level exceeds a first threshold, assert a critical signal to each throttling engine of the plurality of processors. Further, for each processor, the throttling engine of the processor is to perform a sequence of multiple throttling states while the critical signal is asserted by the power controller, where the sequence of multiple throttling states is performed according to a state machine of the throttling engine. Other embodiments are described and claimed.

System for power throttling

In one embodiment, a system on a chip integrated circuit (SoC) is provided that includes graphics processing resources including one or more graphics processing cores a memory subsystem including a memory controller, a physical interface, and a memory device and circuitry to dynamically adjust a voltage and frequency of the memory subsystem based on a workload executed by the graphics processing resources.

Dynamic voltage and frequency scaling for discrete graphics systems

Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.

Systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices

Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.

Methods and apparatus to reduce thermal fluctuations in semiconductor processors

In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

Apparatus and method to provide a thermal parameter report for a multi-chip package

An apparatus is provided which includes: a first storage to store one or more parameters, a second storage to store data, and a third storage. The apparatus may further include a first circuitry to detect a triggering event. The apparatus may further include a second circuitry to, in response to the triggering event, cause transfer of the data from the second storage to the third storage, while one or more components of the apparatus is to operate in accordance with the one or more parameters.

Configurable flush of data from volatile memory to non-volatile memory

Described is an apparatus comprising: a plurality of system agents, at least one system agent including one or more queues; and logic to monitor the one or more queues in at least one system agent and to cause the plurality of system agents to block traffic after satisfaction of a criterion.

Method and apparatus for saving power of a processor socket in a multi-socket computer system

In an embodiment, a processor includes a first chip of a multi-chip package (MCP). The first chip includes at least one core and first chip temperature control (TC) logic to assert a first power adjustment signal at a second chip of the MCP responsive to an indication that a first chip temperature of the first chip exceeds a first threshold. The processor also includes a conduit that includes a bi-directional pin to couple the first chip to the second chip within the MCP. The conduit is to transport the first power adjustment signal from the first chip to the second chip and the first power adjustment signal is to cause an adjustment of a second chip power consumption of the second chip. Other embodiments are described and claimed.

Apparatus and method for thermal management in a multi-chip package

Described is a processor comprising: a plurality of transistors operable to provide dynamically adjustable transistor size, the plurality of transistors coupled at one end to a first power supply and coupled at another end to a second power supply; a circuit coupled to the second power supply, the second power supply to provide power to the circuit; and a power control unit (PCU) to monitor the level of the first power supply, and to dynamically adjust the transistor size of the plurality of transistors so that the second power supply is adjusted to keep the circuit operational.

Apparatus and method for reducing leakage power of a circuit

In an embodiment, a processor includes at least one core to initiate a hot reset, and a peripheral device that is coupled to a root complex fabric via through the root port via an peripheral component interconnect express to on-chip system fabric (PCIE to OSF) bridge. The processor also includes a power control unit that includes reset logic to decouple the peripheral device from the root complex fabric responsive to initiation of the hot reset. After the peripheral device is decoupled from the root complex fabric, the reset logic is to assert a reset of the peripheral device while a first core of the at least one core is in operation. Other embodiments are described and claimed.

Methods and apparatus to effect hot reset for an on die non-root port integrated device

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Bengaluru, India

Phani Kumar Kandula