3M Innovative Properties Company

Petra M Stegmaier

Francois C D'Haese

Eike H Klünker

Stijn A D'hollander

Robin Edgar Wright

Jingjing Ma

Michele A Craton

Thomas Q Chastek

Pierre Reinhard Bieber

Zhong Chen

Siegfried Rainer Goeb

George J Clements

Shijing Cheng

Jeffrey M Imsande

Doreen Eckhardt

Silke D Mechernich

Mareike Richter

Dmitri D Iarikov

John W McAllister

Robert Dennis Waid

Niklas M Matzeit

Eike KLÜNKER

Stijn D'HOLLANDER

John W Mcallister

Eike Kluenker

Robert Denis Waid

Rachid M Ait Lhadj

Francois C D'HAESE

Michel A Vrancken

Francois D'HAESE

The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; −57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.

Process of manufacturing a pressure sensitive adhesive having a low VOC characteristics

The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60&#xb0; C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85&#xb0; C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

Pressure-sensitive adhesive compositions for manufacturing electronic devices

A method of preparing a crosslinked pressure-sensitive adhesive is provided, including exposing at least one radiation crosslinkable pressure-sensitive adhesive composition to radiation from at least one light-emitting diode to crosslink the radiation crosslinkable pressure-sensitive adhesive composition. The crosslinked pressure-sensitive adhesive is optionally a hot melt processable pressure-sensitive adhesive. A radiation crosslinked pressure-sensitive adhesive is provided, prepared by the method. Also, an adhesive article is provided including a flexible backing layer and the radiation crosslinked pressure-sensitive adhesive prepared by the method. The crosslinked pressure-sensitive adhesive tends to exhibit high shear without sacrificing peel force or tack.

Method of preparing crosslinked pressure-sensitive adhesives using a light-emitting diode for crosslinking

The present disclosure is directed to a curable precursor of a pressure sensitive adhesive comprising a) a (co)polymeric material comprising a rubber-based elastomeric material; b) a polyfunctional aziridine curing agent; and c) an acid generating agent. The present disclosure is also directed to a method of manufacturing such pressure sensitive adhesives and uses thereof.

Post-curable rubber-based pressure-sensitive adhesive

The present disclosure relates to a pressure sensitive adhesive foam comprising a rubber-based elastomeric material, at least one hydrocarbon tackifier and a crosslinking additive selected from the group of multifunctional (meth)acrylate compounds. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive foam and uses thereof.

Rubber-based pressure sensitive adhesive foam

The present invention relates to a radiation crosslinkable pressure sensitive adhesive precursor comprising: The present invention is also directed to a method of preparing a radiation crosslinked pressure sensitive adhesive.

Highly tackified acrylate pressure sensitive adhesives

The present invention relates to a radiation crosslinkable pressure sensitive adhesive precursor comprising: a) an acrylate base polymer; b) a co-polymerized type (II) photocrosslinker, in a amount greater than 0.05 parts by weight per 100 parts by weight of acrylate base polymer; c) a co-polymerized hydrogen-donating monomer; and d) a tackifying resin, in an amount greater than 40 parts by weight per 100 parts by weight of acrylate base polymer. The present invention is also directed to a method of preparing a radiation crosslinked pressure sensitive adhesive.

Growing community of inventors

Duesseldorf, Germany

Petra M Stegmaier