Parker-Hannifin Corporation

Peter Z Torok

John Perkins

Robert Cowperthwait

John H Beswick

Matthew Finley

Robert H Foster

David Inman

An electronic housing assembly includes a polymeric housing base and a metallic heat sink secured to the housing base with a snap-fit engagement. A printed circuit board is positioned within a cavity in the housing assembly and is protected within the housing by an environmental seal. The electronic housing assembly allows for expansion and contraction between the heat sink and the housing while maintaining the integrity of the seal.

Electronics housing with heat sink

A polarizer assembly including first and second components having respective first and second channel portions. The first and second components are configured to flex between a pre-fastened state and a fastened state. In the pre-fastened state, a first flange face of a flange of the first component contacts an opposite facing second flange face of a flange of the second component at contact regions along respective edges of the first and second channel portions to form a nonuniform thickness gap between the first and second flange faces outwardly from the contact regions toward outer edges of the first and second components. In the fastened state, the first flange face is engaged flush with the second flange face to close the nonuniform thickness gap.

Polarizer assembly

An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.

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Brockport, NY, United States of America

Peter Z Torok