Leybold Aktiengesellschaft

Leybold-Heraeus Gmbh

Other

Peter Wirz

Barbara Kussel

Peter Hubert

Friedrich-Werner Thomas

Manfred Arnold

Karl-Heinz Schuller

Eberhard Schultheiss

Bernd Wolf

Bernd Cord

Gudrun Przybilla

Heinz-Wilhelm Pfannekuche

Thomas Bathon

Karl Eckert

Apparatus for reactive sputtering of an electrically resistive coating onto a planar substrate includes a magnetron cathode with a planar target of a metal which forms one component of the coating. The reaction gas, which provides another component of the coating, is released as close as possible to the target, but outside of its outline. The distance 'a' between the target surface and the substrate surface is less than 60 mm, and a mask system is provided at a distance 'd' from the substrate which is less than half the distance 'a'. The density of reaction gas particles in front of the substrate is thus increased, resulting in a high deposition rate.

Process and apparatus for depositing coatings of high electrical

Method of applying optical coatings of silicon compounds to substrates by reactive cathode sputtering of siliceous target materials. To solve the problem of improving the utilization of the target material and eliminating the blowout of particles from the target, the target of the invention is a polycrystalline silicon casting of at least 99% silicon containing dopants from the group, boron, antimony, phosphorus and arseic, and it is sputtered by direct current in an atomsphere containing the reaction gas.

Method of applying optical coatings of silicon compounds by cathode

A method and apparatus for fabricating magneto-optical, storable, and/or deletable data carriers. One or more layers, each comprising two or more different chemical materials, are applied on a substrate (4) by means of a magnetron sputtering system (1). The fractional composition of each layer is controlled by changing the strength of the magnetic field produced by the magnetron system (1). By means of a suitable measuring device (51, 58) the compensation temperature of a particular layer is measured and compared with a desired value. If the measured compensation temperature differs from the desired value, the desired value can be attained by adjusting the cathode voltage U.sub.K of the magnetron system. A controller (63) is provided for controlling the cathode voltage and adjusting the distance between the magnetron system's target (6) and magnets (8, 9, 10).

Method and arrangement for fabricating magneto-optical, storable, and/or

In an apparatus for coating a substrate with an organic substance by placing the substrate in a coating chamber containing a gaseous hydrocarbon compound, in which the hydrocarbon compound can be broken down by means of a cathode system having magnets, a plasma is formed in the vicinity of the substrate by applying a radiofrequency voltage to the cathode system while the substrate is held immediately in front of the cathode. The pressure in the coating chamber and the supply of the electric energy from the generator to the cathode are variable for the purpose of achieving a coating quality that will change during the build-up of the coating. For this purpose, electric motor-powered valve means are inserted into the gas supply line and into the pump suction line and are operated through a timing mechanism or a control apparatus which is connected to a vacuum gauge.

Process for coating a substrate with an organic coating having gradated

A reaction gas is admitted in the immediate vicinity of a target on the cathode and a plasma is generated between the target and a substrate to be coated. The intensity of the spectral line of a target material is measured, and is used to provide a first signal with a relatively short time constant to a controller via a first control circuit. A property of the finished coating is sensed after the substrate leaves the coating zone, and is used to provide a second signal with a relatively long time constant to the controller via a second control circuit. The controller uses the combined signals to regulate the admission of the reaction gas so that a pre-established property of the finished coating is kept substantially constant.

Process and apparatus for controlling the reactive deposit of coatings

In an apparatus for the production of coatings with a uniform thickness profile on substrates by cathode sputtering, a substrate carriage held and guided between rollers is provided, which can be driven through the coating chamber, and which has substrate disks rotatably mounted on its side facing the cathode. The axes of rotation of the substrate disks are disposed transversely of the plane of movement of the substrate carriage. On the side of the substrate carriage facing away from the cathode, a row of permanent magnets is fixedly disposed on magnet holders. The permanent magnets produce a disk current in magnetic disks which are joined for co-rotation with the pivot shafts of the substrate disks. On account of the disk current, the magnetic disks, and with them also the substrate disks, are made to rotate in passing along the row of magnets.

Apparatus for the production of coatings of uniform thickness profile on

An apparatus for coating substrates in a vacuum chamber has a cathode system, which is preceded and followed by evacuable isolating chambers. The individual chambers can be separated from one another by locks, and the apparatus has a conduit leading into the coating chamber for feeding one or more process gases. Transport frames carry the substrates through the individual chambers on rails and/or wheels. In such an apparatus one or more bypass lines are provided which connect the coating chamber to the isolating chambers preceding or following it, and a shutoff or valve is inserted into each bypass line and brings about an equalization of pressure between the chambers. By means of a pressure equalization performed in this manner, the constancy of the gas concentrations which is essential in a reactive process to the stability of the process and to uniform coating properties, is automatically assured.

Apparatus for coating substrates

In a cathode sputtering apparatus, in order to achieve a very uniform utilization of the target and a high-quality coating on the substrate, the cathode is provided on its side of the target facing away from the substrate with a flat plate on which a plurality of magnets are disposed in rows, the magnets of the individual rows parallel to one another being at approximately equal distances apart and having the same polarity. Moreover, the magnetic of the one row are offset by a dimension g from the magnets of the adjacent row, so that, in the area of the target provided with the coating material, when the cathode is used in a chamber with suitable gas pressure and with a voltage of any desired frequency is applied, plasma tubes form which are like serpentinely curved racetracks.

Magnetron cathode sputter coating apparatus

Sputtering cathode (1) according to the magnetron principle, having a target (11) of the material to be sputtered, which consists of at least one piece. Behind the target (11) there is a magnet system with a plurality of endless magnet units (14, 15, 16) of alternately different polarity, one inside the other. An endless magnetic tunnel (20) of arcuately curved lines of force is thereby formed. Those poles of the magnet units (14, 15, 16) which are turned away from the target (11) are connected together through a magnet yoke (19) of soft magnetic material. To achieve an especially good target utilization, the geometry and the amount of the magnetic field forming a magnetic tunnel (20) are variable relative to the magnetic field strength of another magnetic field through an electromagnetic (17), the current for the electromagnet (17) being variable in frequency, amplitude and pulse shape.

Magnetron type sputtering cathode

In a sputtering cathode on the magnetron principle with a target consisting of at least one piece and composed of the material to be sputtered, there is disposed in back of the target a magnet system having a plurality of magnet units of alternately different polarity. These form at least two endless magnetic tunnels of arching lines of force situated one within the other. The poles of the magnet units that face away from the target are joined together by a magnet yoke of soft-magnetic material. To solve the problem of being able to deposit coatings of uniform thickness with only one source of power per cathode, provision is made such that the strength of at least one magnetic field forming a magnetic tunnel can be varied relative to the strength of at least one additional magnetic field forming an additional magnetic tunnel.

Sputtering cathode on the magnetron principle

A spectrophotometer obtains transmitted, reflected, or radiated light from at least two measuring points on at least one object and a spectroscopic light disperser disperses the obtained light spectroscopically to measuring cells for electrically indicating the spectrum of the obtained light, whereby the spectrum may be analyzed for indicating optical properties of the object at the measuring point from which the light was obtained. At least one fibre-glass cable respectively carries the light obtained at each measuring point to the spectroscopic light disperser. The ends of the fibres of each cable at the spectroscopic light dispersion are arranged in a row and the row of fibre ends of each cable are parallel to each other in a matrix of fibre ends. At least one light stop allows light from only one fibre-glass cable at a time to carry the light to the spectroscopic light disperser.

Spectrophotometer

A magnetron cathode for sputtering targets of ferromagnetic materials. A cathode ground body (2) has at least one supporting surface (4a, 4c) for the target and a magnet system (6) with magnet poles of opposite polarity cohering on the circumference, lying inside one another, and separated by a gap (5a). The target is divided by at least one air gap geometrically similar to the shape of the interval into at least two target parts (12, 13) which are staggered in the direction of the depth of the cathode on the at least one supporting surface (4a, 4c). In accordance with the invention,

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Waldernbach, Germany

Peter Wirz