Nxp B.v.

Koninklijke Philips Corporation N.v.

Peter Wilhelmus Maria Van De Water

Roelf Anco Jacob Groenhuis

Paul Dijkstra

Cornelis Gerardus Schriks

Johannus Wilhelmus Weekamp

Johan Bosman

Paulus Martinus Catharina Hesen

Hendrik Klaas Kloen

Gerardus Henricus Franciscus Willebrordus Steenbruggen

A method for manufacturing a microelectronic package () comprises the steps of providing at least two members () comprising electrically conductive material; providing a microelectronic device (); placing the electrically conductive members () and the microelectronic device () in predetermined positions with respect to each other, and establishing electrical connections between each of the electrically conductive members () and the microelectronic device (); and providing a non-conductive material for encapsulating the microelectronic device () and a portion of the electrically conductive members () connected thereto. The electrically conductive members () are intended to be used for realizing contact of the microelectronic device () arranged inside the package () to the external world. An important advantage of the method having steps as mentioned is that the electrically conductive members () as such are provided, wherein it is not necessary to provide a conventional lead frame which has the disadvantage of causing considerable waste of material during its manufacturing process.

Method for manufacturing a microelectronic package comprising at least one microelectronic device

The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.

Electronic device and method of manufacturing thereof

The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with a connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. The element is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.

The carrier () comprises a first etch mask (), a first metal layer (), an intermediate layer (), a second metal layer () and a second etch mask (). Both the first and the second etch mask () can be provided in one step by means of electrochemical plating. After the first metal layer () and the intermediate layer () have been patterned through the first etch mask (), an electric element () can be suitably attached to the carrier () using conductive means. In this patterning operation, the intermediate layer () is etched further so as to create underetching below the first metal layer (). After the provision of an encapsulation (), the second metal layer () is patterned through the second etch mask (). In this manner, a solderable device () is obtained without a photolithographic step during the assembly process.

Carrier, method of manufacturing a carrier and an electronic device

In an example embodiment, the semiconductor device comprises a carrier and a semiconductor element, such as an integrated circuit. The carrier is provided with apertures, thereby defining connecting conductors having side faces. Notches are present in the side faces. The semiconductor element is enclosed in an encapsulation that extends into the notches in the carrier. As a result, the encapsulation is mechanically anchored in the carrier. The semiconductor device can be made in a process wherein, after the encapsulating step, no lithographic steps are necessary.

Semiconductor device and method of manufacturing same

The invention relates to a method of manufacturing an electronic component (), in particular a semiconductor component (), which is provided with electric connection regions (), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (). In a method according to the invention, the component () is attached with one () of its sides () to a foil () by means of an adhesive layer (), and the component is provided, on said side (), with the mark (M) through the foil () and the adhesive layer (). In this manner, a large number of components () can be readily provided with a mark (M) without undue handling, and the marking operation can be readily integrated in the complete manufacturing process of the components. Surprisingly it has been found that marking through a radiation-absorbing double layer () is very well feasible. The component () can be attached to the foil () without contact between the electric connection region () and the adhesive layer. Preferably, a large number of components () are manufactured simultaneously and within a single body () that is attached to the foil (). After the provision of the mark (M), the components () are separated from each other.

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Nijmegen, Netherlands

Peter Wilhelmus Maria Van De Water