Plansee Aktiengesellschaft

Peter Wilhartitz

Peter Polcik

Stefan Schönauer

Arno Schintlmeister

The resistivity of an electrically conductive layer of molybdenum or a molybdenum alloy is reduced. For that purpose, a MoOlayer is formed on the surface of the electrically conductive layer. The sheet resistivity can thereby be reduced in the order of magnitude of 10% to 15%.

Process for reducing the resistivity of an electrically conductive layer

The invention relates to a process for manufacturing an evaporation source for physical vapor deposition. The evaporation source is formed of the actual sputtering target with an aluminum component and one or more further components as well as of a backing plate made from a material having better thermal conductivity than the target. The backing plate made of a powdery starting material is pressed, together with the powdery components of the sputtering target, into sandwiched powder fractions and then formed.

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Reutte/Tirol, Austria

Peter Wilhartitz