Massachusetts Institute of Technology

Peter W Wyatt

Carl O Bozler

Jack I Raffel

Simon S Cohen

Steven W Rabe

Jeremy Bert Muldavin

Craig L Keast

A device includes a device wafer having a circuit component formed thereon and having vias formed therein and a cap wafer bonded to the device wafer. The cap wafer has a cavity therein. The cavity has a post formed therein, and the post is positioned to mechanically support the vias formed in the device wafer. The cavity has a volume, the volume substantially enclosing the circuit component formed on the device wafer. The cavity has a width and height such that an impedance of a transmission line is dependent upon the width and height of the cavity, or the impedance of a transmission line is dependent upon the width of a center conductor within the cavity.

Wide band and radio frequency waveguide and hybrid integration in a silicon package

Methods and systems are discussed for fabricating electrically programmable link structures by fabricating a first metal conductor of a refractory conductive material, composite, or an aluminum alloy which has been modified with a refractory material, then fabricating an insulating link material over the first conductor, and subsequently, depositing a second conductor over the link material. In use, an electrical path can be formed between the first and second conductors by applying a voltage between such conductors across at least one selected region of the insulator, such that the insulating link material is transformed in the region and rendered conductive to form an electrical signal path.

Voltage programmable links for integrated circuits

Growing community of inventors

Lincoln, MA, United States of America

Peter W Wyatt