International Business Machines Corporation

Infineon Technologies Ag

Peter W Schneider

Klaus Nierle

Sudesh Saroop

Pamela Castalino

Joseph P Walko

Disclosed are embodiments of a method, a system and a program storage device for simulating electronic device performance as a function of process variations. In these embodiments, functions of a primary model parameter for each of multiple secondary model parameters across multiple different process conditions can be determined based on a relatively small number of target sets of device characteristics. These functions can then be used to augment a simulator so that during subsequent simulations of the electronic device over a wide range of varying process conditions, a change in a value for the primary model parameter will automatically result in corresponding changes in values for the secondary model parameters. By augmenting the simulation environment in this manner, the disclosed embodiments efficiently provide more robust simulation results over prior art techniques.

Method, system and program storage device for simulating electronic device performance as a function of process variations

A technique to simplify the cost and complexity of performing a full wafer test or probe of semiconductor wafers. A probe card connection layer is disposed on a surface of the wafer. The probe card connection layer comprises a plurality of probe contact connection points on a top surface of the probe card connection layer and a plurality of conductive traces on a bottom surface of the probe card connection layer. Each conductive trace is electrically connected to a corresponding probe contact connection point and electrically connected to a similar function connection point on each of a plurality of chips. Each conductive trace carries a test signal supplied to a corresponding probe contact connection point to the similar function connection points of the chips to which it is connected. A test signal can be delivered from a probe card device to multiple chips in the wafer nearly simultaneously from one probe card contact, thus greatly reducing the number of contacts required on the probe card and reducing the time required to test each chip on the wafer.

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Williston, VT, United States of America

Peter W Schneider