Marvell International Limited

Marvellworld Trade Ltd.

Applied Materials, Inc.

Peter W Lee

Winston Lee

Runzi Chang

Pantas Sutardja

Albert M Wu

Chien-Chuan Wei

Sehat Sutardja

Stuardo A Robles

Bang C Nguyen

David N Wang

Makoto Nagashima

Moon-Hae Son

Kazuto Fukuma

Anand Gupta

Thomas E Deacon

Amrita Verma

Ruby Liao

Shankar Vankataranan

Tetsuya Sato

Ellie Y Yieh

David Wingto Cheung

Judy H Huang

Virendra V Rana

Dung-Ching Perng

Virendra V S Rana

Tatsuya Sato

Gary L Fong

Xin Zhang

Vicente M Lim

Visweswaren Sivaramakrishnam

Gayathri Rao

Xinghui Guo

Donald Lee

The present disclosure describes apparatuses and methods for manufacturing programmable memory devices with optimized gate oxide thickness. In some aspects, lithography masks are used to fabricate oxide gates for programmable memory devices of an integrated-circuit (IC) die that are thinner than oxide gates fabricated for processor core devices of the IC die. In other aspects, lithography masks are used to fabricate oxide gates for the programmable memory devices of the IC die such that they are thicker than the oxide gates fabricated for the processor core devices of the IC die. By so doing, the programmable memory devices can be manufactured with optimized gate oxide thickness that may reduce programming voltage or increase device reliability of the programmable memory devices.

Fabricating memory devices with optimized gate oxide thickness

A dual-port memory including a first memory array and at least one address decoder. The first memory array includes memory cells and two ports for each of the memory cells. The at least one address decoder generates word line signals for concurrent access to two ports of one or more cells of the memory cells in a same row of the first memory array. Each of the word line signals is generated to perform a read operation. Pulse widths of the word line signals for the read operations are proportional to a ratio of (i) a reference amount of cell current of a cell of a reference memory array to (ii) an amount of cell current of the one or more cells of the plurality of memory cells in a same row of the first memory array.

Dual-port memories and input/output circuits for preventing failures corresponding to concurrent accesses of dual-port memory cells

In some implementations, a method of fabricating an integrated circuit includes obtaining first data for a first chip containing a first version of the integrated circuit, determining that a transistor should be coupled with another transistor, selecting one or more masks for coupling the transistor with the other transistor to adjust the threshold voltage of the transistor, obtaining second data for a second chip containing a second version of the integrated circuit, determining that the second version of the integrated circuit meets one or more requirements, and preparing a final integrated circuit design for production based on the second version of the integrated circuit.

Integrated circuit manufacturing process for aligning threshold voltages of transistors

Systems and methods described herein provide a memory cell circuit. The memory cell circuit includes a first internal node communicatively coupled to a first write bit line via a first write pass gate, and a second internal node communicatively coupled to a second write bit line via a second write pass gate. The memory cell circuit further includes a first read bit line connected to a first read pass gate and a first transistor, and a second read bit line connected to a second read pass gate and a second transistor. The first internal node is decoupled from the first read bit line by the first transistor, and the second internal node is decoupled from the second read bit line by the second transistor when a write operation and a read operation occur at the same time.

Systems and methods for a high performance memory cell structure

A circuit includes a latch circuit, a buffer transistor having a control terminal coupled to a first output of the latch, a first write transistor having a conduction terminal coupled to the first output and a control terminal coupled to a first write bitline, and a second write transistor having a conduction terminal coupled to a second output of the latch and a control terminal coupled to a second write bitline. A method of operating a memory cell circuit includes providing a first value on first and second write bitlines when a read operation is performed, and when a write operation is performed, providing first and second values on the first and second write bitlines, respectively, when a first storable value is to be stored, and providing the first and second value on the second and first write bitlines, respectively, when a second storable value is to be stored.

Disturb-proof static RAM cells

A system including a resistive element of a memory cell and a device to access the resistive element of the memory cell. The resistive element includes (i) a first electrode, and (ii) a second electrode. The device includes (i) a first terminal connected to a first contact, and (i) a second terminal connected to a second contact. One or more of the first contact and the second contact of the device is respectively connected to one or more of the first electrode and the second electrode of the resistive element via a third contact. A size of the third contact decreases from the one or more of the first contact and the second contact of the device to the one or more of the first electrode and the second electrode of the resistive element of the memory cell.

Resistive random access memory cell structure

Embodiments include a method comprising: receiving a first voltage; and while testing a memory cell: modifying the first voltage to generate a second voltage that is different from the first voltage; and performing a first read operation on the memory cell, based on applying (i) the second voltage to an array of transistors of the memory cell and (ii) the first voltage to the memory cell.

Method and apparatus for screening memory cells for disturb failures

Systems and methods are provided for reading from a static random-access memory (SRAM). The systems and methods include activating a first bitline connected to a first transistor, wherein the first transistor provides access to a state stored by the SRAM. The systems and methods further include preventing a second bitline from being activated when the first bitline is activated, wherein the second bitline is connected to a second transistor that isolates the SRAM from a reference potential when the second bitline is activated, and reading the state stored by the SRAM by triggering a wordline connected to a gate of the first transistor.

Systems and methods for avoiding read disturbance in a static random-access memory (SRAM)

A resistive random access memory system includes a plurality of bitlines, a plurality of wordlines, and an array of resistive random access memory cells. Each of the resistive random access memory cells in the array includes a transistor and a resistive random access memory element connected in a common gate configuration.

Systems and methods for increasing the read sensitivity of a resistive random access memory (RRAM)

Methods and structures for transistors having reduced source contact to gate spacings in semiconductor devices are disclosed. In one embodiment, a method of forming a transistor can include: forming a gate over an active area of the transistor; forming source and drain regions aligned to the gate in the active area; forming source and drain contacts over the source and drain regions, where a spacing from the gate to the source contact of the transistor is less than a spacing from the gate to the drain contact of the transistor; and using one or more modified masks for forming doping profiles for the source region and the drain region.

Reducing source contact to gate spacing to decrease transistor pitch

A cell of a resistive random access memory including (i) a resistive element and (ii) a switch. The resistive element includes (i) a first electrode, and (ii) a second electrode. The switch includes (i) a first terminal connected to a first contact, and (i) a second terminal connected to a second contact. The second contact is connected to the second electrode of the resistive element via a third contact. The third contact has a shape including a first surface and a second surface that is opposite to the first surface. The shape of the third contact tapers inward from the first surface towards the second surface.

Resistive random access memory cell structure with reduced programming voltage

A resistive element of a resistive memory cell. The resistive element includes a contact in communication with a substrate. A bottom electrode is formed on the contact. A transitional metal oxide layer is formed on the bottom electrode. The transitional metal oxide layer includes oxygen vacancies configured to receive donor oxygen atoms. A transition layer formed on the transitional metal oxide layer includes donor oxygen atoms. A reactive metal layer is formed on the transition layer. A top electrode is formed on the transitional metal oxide layer. The transition layer is configured to provide the donor oxygen atoms to the transitional metal oxide layer in response to a voltage being applied to the top electrode.

Resistive memory cell and method for forming a resistive memory cell

A memory system includes first memory cells and second memory cells. Each of the first memory cells includes first and second pass gates including NMOS transistors. Each of the second memory cells include first and second pass gates including PMOS transistors. The first memory cells are pre-charged by one polarity of a voltage supply. The second memory cells are pre-charged by an opposite polarity of the voltage supply.

Concurrent use of SRAM cells with both NMOS and PMOS pass gates in a memory system

A memory including a memory cell and first and second modules. The memory cell has first and second states, where the second state is different than the first state. The first module, subsequent to an initial forming of the memory cell and subsequent to a read cycle or a write cycle of the memory cell, determines a first difference between the first state and a first predetermined threshold or a second difference between the first state and the second state. The second module, subsequent to the first module determining the first difference or the second difference, reforms the memory cell to reset and increase the first difference or the second difference. The second module, during the reforming of the memory cell, applies a first voltage to the memory cell. The first voltage is greater than a voltage applied to the memory cell during the read cycle or the write cycle.

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Fremont, CA, United States of America

Peter W Lee