Nordson Corporation

Peter W Estelle

Laurence B Saidman

Robert J Woodlief

Scott Richard Miller

David R Jeter

Justin A Clark

Benjamin J Bondeson

Enes Ramosevac

Scott B Means

Jeffrey E Owen

Kent Hand

James R Beal

John Matthew Riney

Leslie J Varga

Paul Schmidt

Steven Clark

Howard B Evans

Charles P Ganzer

Christopher R Chastine

Leonard J Lanier

Sang Hyub Shin

Brian R Sosebee

Ronald Ramspeck

David Zgonc

Michael J Palmer

Raymond J Slattery, Iii

Andreas Bornkessel

Bernhard Meyer

John Daniels

Manuel A Guerrero

Hartmut Crull

Per Winkelmann

Andreas Ehlers

Dan Thompson

Ronald M Ramspeck

Raymond Slattery Iii

Howard B Evans Iii

Herr Howard B Evans Iii

Systems and methods for direct heater diagnostics for a hot melt liquid dispensing system are disclosed. At least one of a current measurement or a voltage measurement is received from a respective current and/or voltage sensor positioned at an electrical circuit that supplies electric power to a heater associated with the dispensing system. The heater can be for an applicator or heated hose attached to the dispensing system, a melter of the dispensing system, or a pump of the dispensing system. A state of the electrical circuit is determined based on the at least one of the current or voltage measurement.

Systems and methods for direct heater diagnostics for a hot melt liquid dispensing system

Systems and methods for controlling adhesive application are disclosed. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied per substrate, compare the adhesive applied per substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensor(s) may include one or more of a valve sensor coupled to an adhesive supply, a flow rate sensor coupled to a manifold, a flow rate sensor coupled to one or more hoses, and a flow rate sensors coupled to a gun.

Systems and methods of controlling adhesive application

An adhesive dispensing device () includes a melt module () including a housing () that defines a receiving space to receive adhesive and a heater () to heat the housing to melt the adhesive, and a control module () releasably connected to the melt module. The control module includes a controller () to automatically recognize a characteristic associated with the melt module and operate the melt module using instructions stored on the controller that correspond to the characteristic of the melt module. A method of operating the adhesive dispensing device is also disclosed.

Modular adhesive dispensing device

In one example, a melter has a housing, a heater, a vent, and a filter medium. The housing defines a receiving space that supports adhesive therein. The heater heats the receiving space of the housing to melt the adhesive. The melter defines an adhesive inlet therein that receives adhesive carried by a transport supply gas into the receiving space. The vent extends through a wall of the melter and permits the transport supply gas to escape from the melter. The filter medium is supported in the vent to capture particulates from the transport supply gas escaping the receiving space, and is positioned relative to the receiving space such that heat from the receiving space causes the particulates captured by the filter medium to melt and fall into the receiving space.

Melter with self-cleaning filter

Systems and methods for improved liquid dispensing system communications are disclosed. In an example method for communicating control data between a plurality of component of a liquid dispensing system, a controller of a first component of a liquid dispensing system publishes a control data message to a composite controller associated with the plurality of component. Based on a classification of the control data message, a second component is determined to be a subscriber for the control data message. The composite controller then transmits the control data message to a controller of the second component.

Systems and methods for liquid dispensing system communications

A hot melt dispensing system is described. The hot melt dispensing system includes a melter that melts solid material into hot melt, a pump that pumps the hot melt from the melter to at least one applicator, and a pressure control system that controls a pressure of pressurized air for operating the pump. The pressure control system includes a regulator assembly that controls the pressure of the pressurized air, and a drive component that actuates the regulator assembly. The hot melt dispensing system also includes a controller that determines a pressure setting for the pressurized air. The drive component receives the pressure setting from the controller and actuates the regulator assembly to a position associated with the pressure setting.

Electrically operated pressure control valve

A melter for heating and melting particulate hot melt adhesive into a liquefied form is disclosed. The melter includes a heated receiving device having an interior with an inlet configured to receive the particulate hot melt adhesive and an outlet. A flexible hopper holds a supply of the particulate hot melt adhesive and a particulate hot melt adhesive feed device allows the particulate hot melt adhesive to be directed from the flexible hopper to the inlet of the heated receiving device.

Hot melt adhesive supply and methods associated therewith

An adhesive dispensing system is disclosed. The system includes a heater unit configured to heat an adhesive to an application temperature, a fill system configured to supply the adhesive to said heater unit, and a controller. The controller is configured to actuate the fill system to supply the adhesive to the heater unit, operate the heater unit to maintain a unit set point temperature sufficient to heat the adhesive to the application temperature, and operate the heater unit to reduce its temperature from the unit set point temperature following a first set threshold time from actuation of the fill system to supply the adhesive to the heater unit.

Adhesive dispensing system and method using smart melt heater control

An adhesive dispensing device includes a heater unit for melting adhesive, a fill system communicating with a receiving space for feeding the heater unit, and a reservoir for receiving melted adhesive from the heater unit. The dispensing device also includes a capacitive level sensor located along a sidewall of the receiving space such that the level of adhesive in the receiving space can be detected by sensing the difference in dielectric capacitance where the adhesive is located compared to where air acts as the dielectric. The size of the driven electrode produces a broader sensing window capable of generating multiple control signals corresponding to different fill levels of adhesive. The receiving space and reservoir are minimized in size so that adhesive is not held at elevated temperatures long enough to char or degrade.

Adhesive dispensing device having optimized reservoir and capacitive level sensor

An adhesive dispensing system includes a pump and at least one sensor positioned to sense movements of a component of the pump and produce signals based on the sensed movements. The dispensing system also includes a controller communicating with the at least one sensor to collect information regarding operational cycles of the pump based on the signals. As a result, one or more diagnostic processes are enabled at the controller during operation of the adhesive dispensing system. These diagnostic processes may include a leak rate test for the dispensing system, an overspeed detection test for the pump, and expected life cycle monitoring of the pump or other components.

Adhesive dispensing system and method including a pump with integrated diagnostics

An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.

An adhesive dispensing system includes a pump and at least one sensor positioned to sense movements of a component of the pump and produce signals based on the sensed movements. The dispensing system also includes a controller operating the pump and communicating with the at least one sensor to collect information regarding operational cycles of the pump based on the signals. As a result, one or more diagnostic processes are enabled at the controller during operation of the adhesive dispensing system. These diagnostic processes may include a leak rate test for the dispensing system, an overspeed detection test for the pump, and expected life cycle monitoring of the pump or other components.

Growing community of inventors

Norcross, GA, United States of America

Peter W Estelle