International Business Machines Corporation

Other

Hitachi Global Storage Technologies Netherlands B.v.

Peter Vettiger

Gerd K Binnig

Michel Despont

Walter Haeberle

Peter L Buchmann

Mark Alfred Lantz

Otto Voegeli

Urs T Duerig

Ute Drechsler

Bruno Michel

Bernd W Gotsmann

Hugo Eric Rothuizen

David J Webb

Heinrich Rohrer

Mark I Lutwyche

Robert Dennis Miller

Thomas J Brunschwiler

Craig Jon Hawker

Jane Elizabeth Frommer

Hans Rudolf Schindler

Evangelos Stavros Eleftheriou

Charalampos Pozidis

Sri Muthuthamby Sri-Jayantha

Roy Rongqing Yu

H Bernhard Pogge

Fritz R Gfeller

Gian-Luca Bona

Urs T Durig

Peter Unger

Erwin Bretscher

Thomas Albrecht

Giovanni Cherubini

Johann Greschner

Ajay Dholakia

Akihiko Aoyagi

Chandrika Prasad

Victor Yee-Way Lee

Rolf Allenspach

Christoph S Harder

Peter D Hoh

Harald Bohlen

Peter Nehmiz

Johannes G Beha

Pierre L Gueret

Christoph E Gerber

Kohki Noda

Helmut Engelke

Reto R Schlittler

Heinz Jaeckel

Marcel Gasser

Theodor W Loeliger

Walter Haberle

Alan D Wilson

Armin U Blacha

Volker Graf

Ronald F Broom

Urs H Bapst

Ernst Meyer

Albertus Oosenbrug

Ernst E Latta

Heinz Richard

Graham Cross

Evangelos Elftheriou

Roland W Widmer

Peter Bächtold

Urs T Dürig

Walter Häberle

Michel Desponet

Theodor O Mohr

Bart J Van Zeghbroech

Roland Bennewitz

Mark A Lantz

Cornel Andreoli

Ute Dreschler

J&uuml;rgen P Brugger

J&uuml;rgen Brugger

Jurgen Brugger

Juergen Brugger

Grégoire Genolet

Han Biebuyck

A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.

Semiconductor device with a high thermal dissipation efficiency

A data storage system includes a read/write head having a tip connected to a resistive path locally exerting heat at the tip when an electrical current is applied; and a data storage medium from which information is reproduced by scanning a surface of the medium with a tip positioned in contact therewith, the medium comprising: a substrate; and a polymer recording surface within which data bit values are determined by the topographical state at the bit location, characterized in that the polymer contains thermally reversible crosslinkages.

High density data storage medium

A storage device and a method for scanning a storage medium. A storage medium for storing data in the form of marks is scanned by an array of probes for mark detecting purposes in a scanning mode. The storage medium has fields with each field to be scanned by an associated one of the probes. At least one of the fields has marks representing operational data for operating the scanning mode. Scanning parameters are computed from the operational data and the scanning mode is adjusted according to the computed parameters.

Storage device and method for scanning a storage medium

Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.

A method for writing data to and/or reading data from locations on a surface via a tip comprises moving the tip between the locations on the surface. At each location, energy is selectively applied to the surface via the tip and the tip and the surface are selectively forced together in synchronization with the application of energy.

Data read/write systems comprising a tip

A data storage device is introduced. The data storage device comprises a write head. The write head comprises a heating element and a tip. The write head scans a data storage medium, wherein in an operation mode of the data storage device the tip is in contact with a surface of the data storage medium and heat is applied to the tip by means of the heating element. In order to achieve a good thermal contact between the tip and the data storage medium, the tip comprises a carbon element that is at least partially in contact with the surface in that operation mode. Such a write head can also be applied in the field of scanning probe lithography.

Data storage device comprising write head with carbon element

A method reading, writing, and erasing data includes bringing a thermal-mechanical probe into proximity with a layer of cross-linked polymeric material to induce a deformed region at a point in the film, thereby writing information; bringing a thermal-mechanical probe into proximity with the deformed region, thereby reading information; and bringing a thermal-mechanical probe into proximity with the deformed region, further deforming it in such a way to eliminate the deformed region, thereby erasing the information; and repeating the storing, reading, and erasing steps at points in the film.

A data storage medium is disclosed from which information is reproduced by scanning a surface of the medium with a tip positioned in contact therewith. The medium includes a substrate and a polymer recording surface within which data bit values are determined by the topographical state at the bit location. The polymer contains thermally reversible crosslinkages.

A data processing system comprises a local probe storage array having a plurality of sensors for reading data from a storage surface. A plurality of data processing elements are mounted on the storage array. Each data processing element is connected to different sensor of the array for processing data read by the connected sensor. The data processing elements may be logic gates for performing simple comparisons with input data. Alternatively, each data processing element may comprise more complex logic circuitry for performing more complex functions based on data read by the storage array. Such function may involve a combination of data read by the storage array and data input to the data processing system from an another source. Each data processing element may comprise a complete microprocessor system responsive to data read from the storage array. It will be appreciated that data processing elements may thought of as collectively constituting a form of CPU capable of acting upon data read from the storage array in a parallel and therefor high speed fashion.

Data processing system

A method for forming a microstructures is described. The method comprises: depositing a seed material on a substrate; growing a nanotube from the seed material; depositing microstructure material on the substrate to embed the nanotube in the microstructure material; and, detaching the substrate to release the microstructure. The resulting mictostructure comprises a body portion and a nanotube embedded in the body portion.

Microstructures

The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.

Patterning method

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Langnau am Albis, Switzerland

Peter Vettiger