Rf Monolithics, Inc.

Triquint Semiconductor Corporation

Qorvo Us, Inc.

Other

Schlumberger Technology Corporation

Massachusetts Institute of Technology

R. F. Monolithic, Inc.

Peter V Wright

Timothy S Henderson

Julio C Costa

Merrill Albert Hatcher, Jr

Jon Chadwick

Kenneth W Mays

Clinton S Hartmann

Daniel E Oates

Kerry Burger

Jin W Cho

Alfredo Carlos Anderson

Ray M Parkhurst

Richard S Withers

Alan R Northan

John T Lynch

An integrated passive die includes a substrate, an input node, an output node, and RF filtering circuitry. The RF filtering circuitry includes a number of LC tank circuits coupled between the input node and the output node. Each one of the LC tank circuits include an inductor and a capacitor. The inductor is formed by a metal trace over the substrate. The capacitor is coupled in parallel with the inductor over the substrate. The inductor and the capacitor are provided such that a resonance frequency of the combination of the inductor and the capacitor is less than a self-resonance frequency of the inductor.

Radio frequency filtering circuitry on integrated passive die

A semiconductor device includes a first varactor diode and a second varactor diode. The second varactor diode is coupled in series with the first varactor diode and vertically disposed over the first varactor diode. By vertically disposing the second varactor diode over the first varactor diode, the space occupied by the pair of varactor diodes can be significantly reduced.

Dual-series varactor EPI

The present disclosure relates to a mold module that includes a device layer, a number of first bump structures, a first mold compound, a stop layer, and a second mold compound. The device layer includes a number of input/output (I/O) contacts at a top surface of the device layer. Each first bump structure is formed over the device layer and electronically coupled to a corresponding I/O contact. The first mold compound resides over the device layer, and a portion of each first bump structure is exposed through the first mold compound. The stop layer is formed underneath the device layer. The second mold compound resides underneath the stop layer, such that the stop layer separates the device layer from the second mold compound.

Wafer-level packaging for enhanced performance

Embodiments include apparatuses and methods related to vertically stacked varactors. Specifically two varactors may be constructed of vertically stacked layers including an anode layer, a contact layer, and a varactor layer. The two varactors may share one or more layers in common. In some embodiments the two varactors may share the anode layer in common, while in other embodiments the two varactors may share the contact layer in common.

Dual stack varactor

The present disclosure relates to a wafer-level packaging process. According to an exemplary process, a precursor wafer that includes a device layer with a number of input/output (I/O) contacts, a number of bump structures over the device layer, the stop layer underneath the device layer, and a silicon handle layer underneath the stop layer is provided. Herein, each bump structure is electronically coupled to a corresponding I/O contact. A first mold compound is then applied over the device layer to encapsulate each bump structure. Next, the silicon handle layer is removed substantially. A second mold compound is applied to an exposed surface from which the silicon handle layer was removed. Finally, the first mold compound is thinned down to expose a portion of each bump structure.

A child-safe, cutlery device that separately cores and slices a strawberry includes: a ring having an inner perimeter surface that encloses a central void and an outer perimeter surface, an elongated cutting member having a first end and a second end that are each attached to opposing points on the ring's inner perimeter surface, a top surface with a pointed edge that is adapted to be a cutting edge, a pair of elongated handle members, each of which has a proximal and a distal end and wherein each of the handle members' proximal ends is attached to the ring's outer perimeter surface at one of a pair of spaced-apart, attachment points.

Child-safe, cutlery device for separately coring and/or slicing a strawberry

A frequency-dependent resistor and circuitry employing the same are provided. In some embodiments, a resistor includes a substrate, an input port, an output port, and a conductive trace on the substrate between the input port and the output port. A resistance between the input port and the output port for a low frequency signal is at least five times lower than the resistance between the input port and the output port for an RF signal and the ratio of the frequencies of the RF signal to the low frequency signal is at least fifty. Circuitry including a transistor adapted to selectively couple the input to the output in response to a control signal provided via a resistor with resistance for a low frequency signal at least five times lower than resistance for an RF signal will have a reduced switching time while still isolating the RF signal.

Frequency-dependent resistor and circuitry employing the same

The present disclosure provides a method for fabricating a compound varactor. The method includes steps of depositing a collector layer, depositing a first base layer arranged in a first plurality of parallel fingers directly onto the collector layer, and depositing a second base layer arranged in a second plurality of parallel fingers that are interleaved with the first plurality of parallel fingers directly onto the collector layer.

Compound varactor

Embodiments include semiconductor devices related to compound varactor circuits. Specifically, a semiconductor device may be constructed of a modified anti-series string of varactor pairs, wherein one varactor in a varactor pair has an effective area larger than the other varactor. Varactor pairs in the anti-series string are arranged such that adjacent varactors coupling varactor pairs have equal effective areas. In some embodiments, the anti-series string may have four varactors (two varactor pairs.) In other embodiments, the anti-series string may have eight varactors (four varactor pairs) or twelve varactors (six varactor pairs). The compound varactor using the modified anti-series string of varactor pairs may be advantageous in reducing second harmonics related to parasitic capacitances in anti-series varactor applications.

Single varactor stack with low second-harmonic generation

Embodiments include apparatuses and methods related to a compound varactor. A first varactor in the compound varactor may include a collector layer and a first base layer that is arranged in a first plurality of parallel fingers. A second varactor in the compound varactor may include a second base layer arranged in a second plurality of parallel fingers, and the base layer may be coupled with the collector layer. In embodiments, the fingers of the base layers of the first varactor and the second varactor may be interleaved with one another. Other embodiments may be disclosed or claimed herein.

Embodiments include but are not limited to apparatuses and systems including a quadrature lattice matching network including first path having a series inductor and a shunt inductor, and a second path having a series capacitor and a shunt capacitor. Other embodiments may be described and claimed.

Quadrature lattice matching network

A child-safe, hand, fruit corer and slicer includes: handle, a wire member having two ends and a configuration between these ends that is adapted to: (a) provide the outline of: (i) a triangular-shaped structure that has three corners and a base that is situated approximately perpendicular to the handle's centerline, and (ii) a wing-like structure that extends perpendicular to the handle's centerline from each of the corners of the base of the structure, (b) enable the triangular-shaped structure to penetrate a fruit that is to be cored and sliced, and by the at least 180 degree rotation of the handle to core out a core section of the fruit, and (c) enable this wing-like structure to penetrate and slice the fruit into two halves when the handle is moved forward along the handle's centerline.

Child-safe, hand, fruit corer and slicer

Embodiments of apparatuses, methods, and systems for a radio frequency amplification circuit providing for fast loadline modulation are generally described herein. Other embodiments may be described and claimed.

Growing community of inventors

Portland, OR, United States of America

Peter V Wright