Samsung Electronics Co., Ltd.

ÉClair Medical Systems, Inc.

Peter V Schwartz

Ephraim Suhir

Yi Zhang

Carlos Dangelo

Subrata Dey

Roger L Kroeze

Yuan Xu

Barbara Wacker

Bala Padmakumar

Judith Apsay Guzman-Cottrill

Jonathan W Carmichael

Arthur Boren

Darin Olsen

Scott Anthony Garvey

Eric Randall Meier

K S Ravindhran

The present invention extends to methods, apparatus, and systems for disinfecting articles with ozone. Aspects of the invention use increased concentrations ozone in sealed, confined volumes, such as, for example, carts, lockers, cabinets, etc. to disinfect or sterilize medical articles. A medical article is placed in a confined volume. The confined volume is sealed so that the atmosphere inside the sealed, confined volume is isolated from the external atmosphere. The concentration of ozone in the sealed, confined volume is rapidly increased to a threshold concentration. At the threshold ozone concentration, the medical article can be disinfection or sterilized in a reduce amount of time. When disinfection or sterilization is complete, the concentration of ozone in the sealed, confined volume is rapidly reduced to a safe level. The sealed, confined volume is unsealed. The disinfected or sterilized medical article can be removed from the confined volume.

Disinfecting articles with ozone

One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at &#x2dc;1350 cmwith an intensity ID, a G peak at &#x2dc;1585 cmwith an intensity IG, and an intensity ratio I/Iof less than 0.7 at a laser excitation wavelength of 514 nm. The thermal interface material has: a bulk thermal resistance, a contact resistance at an interface between the thermal interface material and the copper substrate, and a contact resistance at an interface between the thermal interface material and a solid-state device. A summation of these resistances has a value of 0.06 cmK/W or less.

Carbon nanotube-based structures and methods for removing heat from solid-state devices

One embodiment involves an article of manufacture that includes: a copper substrate plug with a front surface and a back surface; a catalyst on top of a single surface of the copper substrate plug; and a thermal interface material on top of the single surface of the copper substrate plug. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate plug. The copper substrate plug is configured to be incorporated in a peripheral structure of a heat spreader or a heat sink. In another embodiment, the thermal interface material is on top of both the top and bottom surfaces of the copper substrate plug.

Composite carbon nanotube-based structures and methods for removing heat from solid-state devices

Growing community of inventors

Livermore, CA, United States of America

Peter V Schwartz