Mykrolis Corporation

Applied Materials, Inc.

Peter V Kimball

Harald Herchen

Vincent E Burkhart

Jieh-Hwa Shyu

Craig L Brodeur

Iraj Gashgaee

David W Stockbower

Geoffrey W Kaiser

Quinwei Wu

Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Anode impedance control through electrolyte flow control

A plating cell base design that utilizes a single connection that provides both fluid communication and electrical communication to the cell. The design eliminates many of the components previously necessary to effectuate fluid and electrical seals. With fewer connections, material cost is reduced, reliability is enhanced, and downtime is reduced.

Simultaneous electrical and fluid connection for anode

A metal anode having at least a portion of which formed in a spiral configuration is disclosed. The spacing between the adjacent spirals of the anode is essentially uniform in order to provide uniform fluid flow and electrical characteristics. The anode may be formed of a metal rod or sheet or may be cast from a metal. The anode surfaces of the spiral may be flat or have a configuration such as a corrugated surface to enhance the surface area of the anode. The use of spacers, electrically conductive or insulative, within the spaces between the spirals to maintain their uniform distance is also disclosed. The use of one or more buss bars enables the anode to be supplied with a constant electrical source and may also function as a means for monitoring anode consumption over time. The anode is preferably used in an electroplating bath as the source of the metal used for plating. This is particularly of value in the electroplating of silicon wafer surfaces.

Spiral anode for metal plating baths

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Harvard, MA, United States of America

Peter V Kimball