Robert Boschgmbh

Peter Urbach

Alexander Wallrauch

Alfred Goerlach

Richard Spitz

Wolfgang Feiler

Christoph Ruf

Kuno Wolf

Ning Qu

Klaus Heyers

Holger Scholzen

Gerhard Koelle

Uwe Knappenberger

Peter Flohrs

Horst Meinders

Wolfgang Jacob

Ralf Schmid

Horst Braun

Bernd Bireckoven

Thomas Raica

Thomas Bilsing

Holger Haussmann

Barbara Will

Stefan Hornung

Dirk Scholz

Hans-Reiner Krauss

Karin Hamsen

Dana Keppeler

Juergen Zaremba

A semiconductor component and a method for manufacturing such a semiconductor component which has a resistance behavior which depends heavily on the temperature. This resistance behavior is obtained by a special multi-layer structure of the semiconductor component, one layer being designed in such a way that, for example, multiple p-doped regions are present in an n-doped region, said regions being short-circuited on one side via a metal-plated layer. For example, the semiconductor component may be used for reducing current peaks, by being integrated into a conductor. In the cold state, the semiconductor component has a high resistance which becomes significantly lower when the semiconductor component is heated as a result of the flowing current.

Semiconductor component

Electric motor (), in particular for adjusting moving parts in a motor vehicle, comprising an electronic unit () with a sandwich construction, which contains a first electrically conductive substrate () and a second electric conductive substrate (), between which power components are located and electrically connected to both substrates (), and a side () of the second substrate () facing away from the first substrate () is equipped with additional electronic components (), wherein the first substrate () is embodied as a punched grid (), which together with the second substrate () is extrusion coated with a plastic body () in such a way that the extensions () of the punched grid () protrude from the plastic body (), forming an electrical and/or mechanical interface () for connecting additional motor components ().

Electric motor comprising an electronic unit with a punched grid

An electrical component, e.g., a press-in diode, is provided, which is suited for high currents and which ensures reverse-polarity protection. The electrical component includes at least one chip which is connected via soldering layers to a lead wire and a base. In the event of a rising temperature caused by polarity reversal, the clamp-type connection between the individual parts of the electrical component, e.g., the lead wire and the base, is released since the connecting plastic sheath softens, resulting in the release of the clamp-type connection, thereby interrupting the electrical connection and thus a current flow. At normal operating temperature, the clamp-type connection between the individual parts of the diode is ensured via a plastic sheath and a plastic sleeve, with bulges of the lead wire and the base protruding into the plastic sheath, thereby making the connection particularly stable.

Electrical component

A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.

Soldering method for mounting electric components

The invention relates to an electrical machine, preferably an alternator ( ) for motor vehicles, comprising a rectifier assembly ( ) that is fixed to an end shield ( ) of the machine. Said rectifier assembly is cooled by a fan ( ) that operates in the end shield ( ), the diodes being positioned on a negative connecting plate ( ) and a positive connecting plate ( ) of the rectifier assembly ( ). The aim of the invention is to evacuate the dissipated heat from the rectifier assembly ( ) in an advantageous manner. To achieve this, the rectifier assembly is located in an opening in the front face ( ) of the end shield ( ) and is connected in an electrically and thermally conductive manner by one of its two connecting plates ( and ) to a cooling body ( ), which is connected to the exterior of the end shield ( ) and covers the opening ( ). The cooling air that is thus taken in by the fan ( ) first flows from the exterior across the cooling body ( ) in a radial manner towards the interior, entering the machine in the vicinity of the shaft through orifices ( ) in the end shield ( ) and from here, having reached the fan ( ), subsequently flows past the other connecting plate ( and ) in a radial manner towards the exterior.

Rectifier assembly having heat-dissipating structure for an alternator

A power converter having at least two semiconductor substrates is provided. Each of the substrates has at least two contact surfaces, and the converter also has two thermally conductive mounting plates carrying the semiconductor substrates, which each have an electrical terminal, an attachment arrangement implemented on one of the mounting plates, and having at least one third electrical terminal, which is distinguished in that the mounting plates and the semiconductor substrates form stacks, the mounting plates receiving the semiconductor substrates between themselves, and an electrically and thermally conductive insert, which has at least the third terminal, is arranged between the semiconductor substrates.

Power converter and method for producing the same

Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semiconductor component is disposed between two adjacent carrier substrates of the stack and is contacted electrically and heat-conductively to at least one conductor track of a carrier substrate disposed in the stack above the semiconductor component and to at least one further conductor track of a carrier substrate disposed in the stack below the semiconductor component. To both improve heat output and provide a compact design, the two outer carrier substrates of the stack are embodied as one upper and one lower housing wall of a closed housing part surrounding the at least one semiconductor component, and the interstices between the stacked carrier substrates are tightly closed by an encompassing wall secured to the carrier substrates.

Power semiconductor module

Growing community of inventors

Reutlingen, Germany

Peter Urbach