Epcos Pte Ltd

Sonion Mems A/s

Microtronic A/s

Pulse Mems Aps.

Peter Ulrik Scheel

Matthias Mullenborn

Jochen Friedrich Kuhmann

Pirmin Rombach

Christian Wang

Jörg Rehder

A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.

Miniature microphone assembly with hydrophobic surface coating

The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Surface mountable transducer system

The present invention relates to compact solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is easier and more economical to manufacture compared to any other system disclosed in prior art. In addition the invention is compatible with electronic equipment manufacturing processes, such as SMD pick and place techniques. The invention uses a transducer chip comprising a chamber, a diaphragm that is positioned at the first lower surface and covering the second opening of the transducer chip. The transducer chip is flip-chip mounted onto a post-processed chip also comprising a chamber. The microphone system can be electrically connected to an external substrate by conventional techniques such as wire bonding.

Pressure transducer

The present invention relates solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.

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Gentofte, Denmark

Peter Ulrik Scheel