The Boeing Company

Peter Timothy Heisen

Julio A Navarro

Scott A Raby

Ming Chen

Jimmy Susumu Takeuchi

Richard Neal Bostwick

Harold Peter Soares, Jr

Robert Tilman Worl

Lixin Cai

Alec Adams

John Byam O'Connell

Bruce Larry Blaser

Stephen Lee Fahley

Rodney D Cameron

Mark Gregory Bedson

Douglas Allan Pietila

Mark Richard Davis

Dan R Miller

Isaac Ron Bekker

Raymond Say

Randal L Ternes

Korey Martin Holmstrom

Richard N Bostwick

John B O'Connell

Jimmy S Takeuchi

Antenna elements include a metallic square ring patch and a metallic square ring slot to transmit or receive radio frequency (RF) signals. The antenna elements use several dielectric layers that are separated by a low-dielectric foam layer upon which the square ring patch is positioned. The antenna elements may be arranged into an antenna array that is tunable to collectively generate or receive RF signals to and from airborne and mobile vehicles with an agile, electronically scanning antenna array beam, with no moving parts. The antenna array includes a top section to communicate RF signals; a bottom section to generate a desired RF signal; and a foam layer between the top and bottom sections to separate the ring patch from the ring slot. High isolation between the top section and the bottom section allows the antenna elements to be used in higher gain and high-power arrays without adverse feedback issues.

High isolation ring slot patch radiator for phased array antennas

Antenna elements include a metallic square ring patch and a metallic square ring slot to transmit or receive radio frequency (RF) signals. The antenna elements use several dielectric layers that are separated by a low-dielectric foam layer upon which the square ring patch is positioned. The disclosed antenna elements may be arranged together in an antenna array that is tunable to collectively generate or receive RF signals. In particular, the antenna array functions as a 256-element transmit/receive half-duplex antenna, operating in transmit or receive mode for half the time. The antenna array includes a radiator block, a transmit/receiver (T/R) amplifier block, a beamformer block, and a distribution network block.

Low cost electronically scanning antenna array architecture

A system and method for assembling an antenna comprising an aperture plate having a plurality of aperture elements therethrough is disclosed. The method comprises forming a matrix of the at least a subset of the dielectric loads, each dielectric load having a longitudinal axis, the matrix of the at least a subset of the dielectric loads joined together by planar sacrificial interconnecting material perpendicular to the longitudinal axis of each dielectric load of the subset of dielectric loads, inserting the matrix of the at least a subset of the dielectric loads in at least a subset of the plurality of aperture elements, and removing planar sacrificial interconnecting material. Another embodiment is evidenced by an antenna produced by the foregoing steps. Multiple embodiments are disclosed.

Phased array antenna aperture and method for producing same

Disclosed is a switchable transmit and receive phased array antenna ('STRPAA'). As an example, the STRPAA may include a housing, a multilayer printed wiring board ('MLPWB') within the housing having a top surface and a bottom surface, a plurality of radiating elements located on the top surface of the MLPWB, and a plurality of transmit and receive (&#x201c;T/R&#x201d;) modules attached to the bottom surface of the MLPWB. The STRPAA may also include a plurality of vias, wherein each via, of the plurality of vias, passes through the MLPWB and is configured as a signal path between a T/R module, of the plurality of T/R modules, on the bottom surface of the MLPWB and a radiating element, of the plurality of radiating elements, located on the top surface of the MLPWB opposite the T/R module.

Switchable transmit and receive phased array antenna

A method includes coupling a printed circuit board (PCB) and a first conductive sheet to a pressure plate to form an antenna sub-assembly. The first conductive sheet defines a first plurality of openings and includes a first plurality of bumps. At least one opening of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps. The method includes coupling the antenna sub-assembly to a cover to form an antenna assembly.

Radio frequency grounding sheet for a phased array antenna

A method and apparatus for aligning components on a module are disclosed. A flexible circuit may be attached to a module in which a tooling apparatus is attached to the module. A plurality of circuit pads on a functional section of the flexible circuit is aligned by a first alignment structure located on a sacrificial portion of the flexible circuit to a second alignment structure on the tooling apparatus. The flexible circuit is attached to the module while the flexible circuit is in an aligned position.

Method and apparatus for aligning and installing flexible circuit interconnects

Structure and method for an aperture plate for use in a phased array antenna is disclosed. The aperture plate includes a plurality of waveguide transitions, each with a radiating end, a coupling end and a body portion extending from the radiating end to the coupling end. The waveguide transitions are spaced apart from each other wherein at least a pair of waveguide transitions are spaced apart closer to each other at the radiating end than at the coupling end. The method of manufacturing an aperture plate for a phased array antenna includes sizing a plurality of waveguide transitions based upon certain operating requirements, determining a radiating lattice spacing and configuration based upon the operating requirements, determining a coupling lattice spacing and configuration based upon antenna electronics packaging, optimizing an aperture plate thickness to achieve the radiating lattice and the coupling lattice spacing and configuration, and forming the aperture plate.

Phased array antenna with lattice transformation

The invention removes copper from the concave side of a flex circuit around a bendable region and replaces it with a conductive epoxy to allow it to be formed to tighter bend radii than would otherwise be possible. After the flex circuit is shaped in a tight radius and attached to a mechanical structure, the conductive epoxy is cured to act as functional replacement of the removed copper.

Stripline flex circuit

Method and structure for a microwave antenna module is provided. The method includes, creating a laminate structure by laminating a plurality of conductive layers and dielectric layers; creating a plurality of layers within the laminate structure to interconnect the plurality of conductive layers and dielectric layers; laminating a base plate to a bottom of the laminate structure; wherein the baseplate operates as a heat sink; and laminating a seal ring to a top periphery of the laminate structure.

Method and structure for RF antenna module

An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.

Phased array antenna architecture

A dual beam electronically scanned phased array antenna architecture including a plurality of antenna modules orthogonally connected to a signal distribution board. Each module includes a radiator board orthogonally connected to a first end of a support mandrel. Each radiator board includes RF radiators and a pair of chip carriers mounted to opposing sides of the respective mandrel and interconnected to the respective radiator board. Each module includes a signal transfer board formed to fit around a second end of the mandrel such that it is compressed between the mandrel and the signal distribution board, and a pair of signal distribution bridges mounted to the opposing sides of the mandrel. Each signal distribution bridge interconnects respective chip carriers with the signal transfer board and distributes digital, DC and/or RE signals received from the signal transfer board to a plurality of beam scanning circuits included in the respective chip carrier.

Compact, dual-beam phased array antenna architecture

A method and apparatus for aligning components on a module. A flexible circuit may be attached to a module in which a tooling apparatus is attached to the module. A plurality of circuit pads on a functional section of the flexible circuit is aligned by a first alignment structure located on a sacrificial portion of the flexible circuit to a second alignment structure on the tooling apparatus. The flexible circuit is attached to the module while the flexible circuit is in an aligned position.

Method for aligning and installing flexible circuit interconnects

A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.

Method and system for angled RF connection using a flexible substrate

An electrical connector apparatus and method for connecting circuit traces on two or more independent circuit board assemblies. A compressible elastomeric member is wrapped with a flexible circuit assembly having a plurality of independent circuit traces, with each circuit trace including a pair of raised electrical contacts. The compressible member with the electrical circuit wrapped over it is supported by a holder assembly. The holder assembly is secured to one of a pair of adjacently positioned independent printed circuit assemblies. The compressible member is held by the holder assembly so that it is compressed against both of the printed circuit board assemblies. The raised electrical contacts electrically contact traces on each of the printed circuit assemblies to complete the electrical connections between the circuit assemblies. The apparatus is especially useful in applications where a large plurality of electrical connections need to be made between independent circuit board assemblies in a very limited space.

Growing community of inventors

Kent, WA, United States of America

Peter Timothy Heisen