Schurter Ag

Ppc Electronic Ag

Siemens Aktiengesellschaft

Peter Straub

Peter Diehm

Dietrich Richter

Marian Lancki

Dieter Berchtold

Hans-Peter Blättler

Hans-Georg Wissmeier

Benjamin Schibli

Guido Signer

Jose Ramos

Mauro Castellani

Peter Weber

José Ramos

A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

Method for the production of a fuse

An activatable thermal fuse includes a first electrical terminal, a second electrical terminal, and an electrically conductive bridge element having a first electric contact with the first electrical terminal and a second electric contact with the second electrical terminal. At least a part of the bridge element is displaceable from a first position in which the first contact is established to a second position in which the first contact is opened, and a thermally sensitive member releases the part when exposed to a predetermined temperature value. An activating element blocks displacement of the part from the first position, in a first position of the activating element, and enables the displacement of the part in a second position of the activating element. A method of manufacturing a printed circuit board, a method of monitoring, and an electronic circuit including the thermal fuse are also provided.

Activatable thermal fuse

A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

Fuse element

The invention relates to a fuse element (__), comprising two connecting contacts (____&#x2033;) and an interposed conductive track (__), wherein the conductive track (__) has a reduced line-cross-section, in relation, to the connecting contacts (____&#x2033;) at least in some sections, further comprising at least one overlay (___&#x2033;), wherein the fuse element (__) and the overlay (___&#x2033;) each comprise materials which undergo diffusion when a predetermined ambient temperature is exceeded and when an electric current is conducted by the fuse element (__). The invention further relates to a fuse (TO) having such a fuse element (__) and a base support (), wherein the fuse element (__) is disposed on a surface of the base support ().

Fuse element, a fuse, a method for producing a fuse, SMD fuse and SMD circuit

A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Improved mechanical, thermal and electrical properties are attained by virtue of the fact that the insulating layer is a thin glass layer.

Printed circuit board and method for producing a printed circuit board

The invention relates to a printed circuit board ( ) which has at least one electrical conduction level (EL) for relaying electrical signals and/or currents and at least one optical conduction level (OL) for relaying optical signals. Said conduction levels (EL, OL) are placed on top of each other in a stack inside the printed circuit board ( ) and are interconnected. The aim of the invention is to provide a particularly flexible and simple construction and a simplified production method. To this end, the optical conduction level (OL) comprises at least one thin glass layer ( ) as a conductor element.

Printed circuit board for electrical and optical signals and method for producing the same

A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8) The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).

Circuit-board overlaid with a copper material on both sides or in

A circuit-board overlaid with a copper material on both sides with a lead-tin layer on the copper material and a plate-shaped heat sink (6). To achieve desirable dissipation of heat generated by electronic components on such circuit-board, the heat sink (6) is provided with a copper surface and then a layer of silver (8) applied to it is soldered to one side of the circuit-board (1). In a method of fabricating the circuit-board, a heat sink (6) having a copper surface is provided with a silver layer (8) and is applied to the circuit board (1) with its side (7) having the silver layer (8). The heat sink (6) is pressed with the circuit board (1) and a heated platen (20) in close contact with the heat sink (6).

Growing community of inventors

Oberwil/Zug, Switzerland

Peter Straub