Applied Materials, Inc.

Cellink Corporation

Velo3d, Inc.

Aeris Capital Sustainable IP Ltd.

Veo3d, Inc.

Peter Stone

Christopher Sean Olsen

Kevin Michael Coakley

Will Findlay

Emily Hernandez

Jose Juarez

Gregory Ferguson Brown

Joseph Pratt

Vidya Viswanath

Malcolm Parker Brown

Ping Han Hsieh

Teng-fang Kuo

Benyamin Buller

Lara Hawrylchak

Jeffrey A Tobin

Theresa Kramer Guarini

Manoj Vellaikal

Tasso Lappas

Saurabh Chopra

Rueben Joseph Mendelsberg

Kimon Symeonidis

Nina Cathryn Bordeaux

Chi Wei Lo

Zachary Ryan Murphree

Brian Charles Spink

David B Jackrel

Katherine Dickey

Kristin Pollock

Jacob Woodruff

Zhenwen Ding

Malcom Parker Brown

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

Flexible hybrid interconnect circuits

Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process, where at least one etching process gas comprising chlorine gas and an inert gas is used during the plasma etch process and forming an epitaxial layer on the surface of the silicon-containing substrate.

Cleaning method

Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to methods and apparatuses for surface preparation prior to epitaxial deposition. In one implementation, a method of processing a substrate is provided. The method comprises etching a surface of a silicon-containing substrate by use of a plasma etch process to form an etched surface of the silicon-containing substrate and forming an epitaxial layer on the etched surface of the silicon-containing substrate. The plasma etch process comprises flowing an etchant gas mixture comprising a fluorine-containing precursor and a hydrogen-containing precursor into a substrate-processing region of a first processing chamber and forming a plasma from the etchant gas mixture flowed into the substrate-processing region.

Embodiments of the present invention generally relate to methods for removing contaminants and native oxides from substrate surfaces. The methods generally include removing contaminants disposed on the substrate surface using a plasma process, and then cleaning the substrate surface by use of a remote plasma assisted dry etch process.

Method and apparatus for precleaning a substrate surface prior to epitaxial growth

Flexible hybrid interconnect circuit

The present disclosure provides three-dimensional (3D) printing methods, apparatuses, systems and/or software to form one or more three-dimensional objects, some of which may be complex. The three-dimensional objects may be formed by three-dimensional printing using one or more methodologies. In some embodiments, the three-dimensional object may comprise an overhang portion, such as a cavity ceiling, with diminished deformation and/or auxiliary support structures.

Three-dimensional printing of three-dimensional objects

Growing community of inventors

Los Gatos, CA, United States of America

Peter Stone