Infineon Technologies Ag

Siemens Aktiengesellschaft

Infineon Technologies Austria Ag

Bundesdruckerei Gmbh

Circle Smart Card Ag

Genua Gmbh

Peter Stampka

Frank Pueschner

Michael Huber

Jens G Pohl

Thomas Spoettl

Detlef Houdeau

Juergen Hoegerl

Wolfgang Schindler

Josef Kirschbauer

Juergen Hoelzl

Martin Buchsbaum

Frank Puschner

Ralph Domnick

Andreas Mueller-Hipper

Frank Püschner

Hans-Georg Mensch

Daniel Weiss

Hans-Hinnerk Steckhan

Petteri Palm

Berndt Gammel

Manfred Paeschke

Josef Heitzer

Mathias Belzner

Guenther Ruhl

Marcus Janke

Christian Hauser

Walther Pachler

Jörg Fischer

Josef Gruber

Erik Heinemann

Joerg Fischer

Manfred Fries

Peter Scherl

Markus Tietke

Stephan Rampetzreiter

Thies Janczek

Josef Mundigl

Michael Knebel

Olaf Dressel

J&uuml;rgen Fischer

Andreas Karl

Jurgen Fischer

Gerhard Schraud

Ewald Simmerlein-Erlbacher

Siegfried Hoffner

Andreas Müller-Hipper

Richard Scheuenpflug

Helmut Graf

Uwe Wagner

Birgit Binder

Bettina Latka

Reinhard Proske

Peter Striegel

Volker Rohde

Martin Klimke

Detelf Houdeau

Stefan Troelenberg

Christl Niederle

Kristof Bothe

Matthias Ochs

Per Krueger

A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

Sensor device, method of forming a sensor device, chip card and method of forming a chip card

In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.

Smart card module, method for producing a smart card module, smart card and method for testing a smart card module

In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.

Chip card module and method for producing a chip card module

Various embodiments provide a communication module having a carrier, a loop antenna, a modulation circuit which is coupled to the loop antenna and is configured to modulate or demodulate signals which are received or transmitted using the loop antenna, and an impedance matching circuit for matching the impedance of the loop antenna to the input impedance of the modulation circuit. The modulation circuit and the impedance matching circuit are arranged inside the loop antenna on or in the carrier.

Communication module

A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.

Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card

A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

Chip card and method of forming a chip card

One embodiment describes a chip arrangement having a chip carrier; a chip which is arranged in or on the chip carrier; a light sensor arrangement; a transparent layer which covers the light sensor arrangement, the light sensor arrangement being set up to determine a light pattern of light received by the light sensor arrangement from outside the chip arrangement through the transparent layer; and a test circuit which is set up to check whether the light pattern matches a reference light pattern and to output a signal on the basis of the result of the check.

Chip arrangement and method for checking whether a chip is arranged in an intended chip carrier

In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.

Multicolored logo on smart card modules

A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.

Chip card module arrangement, chip card arrangement and method for producing a chip card arrangement

An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.

Electronic identification document

A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200&#xb0; C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

Semiconductor package, smart card and method for producing a semiconductor package

According to one embodiment, a hybrid antenna is described comprising a plurality of windings wherein each winding comprises a loop antenna portion arranged in a plane and a ferrite antenna portion arranged at least partially outside of the plane.

Hybrid antenna, antenna arrangement and method for manufacturing an antenna arrangement

In various embodiments, a chip card module is provided that can have: a chip card module support; a wiring structure that is arranged on the chip card module support; an integrated circuit that is arranged on the chip card module support and is electrically coupled to the wiring structure; a chip card module antenna that is arranged on the chip card module support and is electrically coupled to the wiring structure, and a lighting device that is arranged on the chip card module support and is electrically coupled to the wiring structure.

Chip card with integrated active components

A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna.

Secure epass booklet based on double chip technology

A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.

Smart card module for a smart card

Growing community of inventors

Burglengenfeld, Germany

Peter Stampka