Silicon Laboratories Inc.

Peter Smith

Raymond J Speer

Leon Cavanagh

Jane Blake

John Blake Pavelka

An integrated circuit gas sensor system may include an integrated circuit having a bond pad layer and a dielectric layer formed after the bond pad layer. A conductor layer may be above the dielectric layer. The conductor layer may be utilized to form both gas sensor and humidity sensor conductor patterns, which may be planar. In one embodiment, the gas sensor is combined with a humidity sensor, the gas sensor and the humidity sensor covering more than 50% of the top surface of the integrated circuit. In one embodiment, the central region of the integrated circuit has a majority of its surface area utilized for the sensor structures, and in a more preferred embodiment has more than 80% of its surface area utilized for sensing structures. In one embodiment, resistive sensing may be utilized for the gas sensor and capacitive sensing may be utilized for the humidity sensor.

Integrated gas sensor

Systems and methods are provided for packaging integrated circuit (IC) gas sensor systems that employ at least one gas sensor that is formed as part of an integrated circuit and configured to sense the presence and/or concentration of a target gas or other gas characteristics that may be present in the ambient gaseous environment surrounding the packaged IC gas sensor system.

Systems and methods for packaging integrated circuit gas sensor systems

Gas sensor materials and methods are disclosed for preparing and using the same to produce gas sensor structures. Also disclosed are gas sensor structures and systems that employ these disclosed materials. A gas sense-enhancing metal such as platinum may be added to a gas sensitive metal oxide material in a manner that more highly disperses the added platinum than conventional methods so as to more effectively utilize the platinum at a lower concentration, thus achieving a more cost effective solution. An ink vehicle may also be used for deposition of a gas sensitive material (e.g. on the surface of integrated circuit) that is formulated to allow 'burn-out' of ink vehicle components at relatively low temperatures as compared to conventional ink vehicles.

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Summertown, United Kingdom

Peter Smith