Plansee Se

Sag Motion Gmbh

Sag Motion Ag

Vöcklabrucker Metallgießerei Dambauer Gmbh

Peter Schumacher

Gerhard Dipl-Ing Leichtfried

Wolfram Knabl

Christian Linke

Thomas Pabel

Jiehua Li

Georg Dambauer

A sputtering target is composed of an alloy consisting of 5 to 70 at % of at least one element from the group of (Ga, In) and 0.1 to 15 at % of Na, the remainder being Cu and typical impurities. The sputtering target includes at least one intermetallic Na-containing phase.

Cu&#x2014;Ga&#x2014;In&#x2014;Na target

A method for the refining and structural modification of Al&#x2014;Mg&#x2014;Si alloys for permanent-mold casting or sandcasting, which Al&#x2014;Mg&#x2014;Si alloys have the general composition of 5.0-10.0 weight % Mg; 1.0-5.0 weight % Si; 0.001-1.0 weight % Mn, 0.01-0.2 weight % Ti, less than 0.001 weight % Ca, less than 0.001 weight % Na, and less than 0.001 weight % Sr, and as the remainder, Al, and wherein phosphorus is added to the alloy melt in a quantitative range of from 0.01 to 0.06 weight %, referred to the total mass of the alloy.

Method for the refining and structure modification of AL-MG-SI alloys

Growing community of inventors

Leoben, Austria

Peter Schumacher