Siemens Aktiengesellschaft

Peter Schack

Helmut Freller

Konrad Mund

Wolfgang Welsch

Hans Kruger

Heinrich Hassler

Ludwig Schultz

Martin Edeling

Hans P Lorenz

Friedrich Horauf

Hans J Rolke

Andre Peetermans

Hans Schuster-Wolden

Solder-repelling coating for tools

In the process according to the invention, material is vaporized off a cathode and deposited on a substrate in a cathodic arc vaporization process, the arc base being moved on the cathode surface in a random or controlled manner. In the arc vaporization process, preferably at least two cathodes of different alloys or mixtures of the metallic components of the high temperature superconductor (HTSC) are activated for vaporization by an arc and the materials vaporized out of the different alloys are jointly deposited on the substrate, the arc vaporization process occurring reactivity under oxygen atmosphere of preset O.sub.2 partial pressure. A heat treatment for adjusting the structure and oxygen stoichiometry suitable for superconduction can be carried out after or during the vaporizing process.

Production of thin layers of a high temperature superconductor (HTSC) by

In particular for coating tools and product components, which are subject to extremely high wear, metal nitride films are used. It has been found that if the metals have markedly different melting points, in accordance with the invention, the concentrations of the metals can be varied as a function of the film thickness. For manufacturing such mixed nitride films by vaporization of metal alloy cathodes by means of an arc while simultaneously introducing nitrogen as reaction gas, a variable voltage is applied to the substrate during vaporization of the metal alloy and varied as a function of the film thickness on the substrate.

Method of making mixed nitride films with at least two metals

In a method for manufacturing an implantable electrode, particularly a stimulating electrode, vitreous carbon is sputtered from a vitreous carbon target on at least a part of the surface of the electrode. The sputtering is performed in an argon atmosphere at a pressure of 4 to 8.times.10.sup.-2 mbar and at a voltage of 1.6 to 2.4 kV. The electrode may consist essentially of platinum-iridium, vitreous carbon or platinum.

Method for the fabrication of an implantable electrode

A simplified, easily producible, strongly adherent, solderable and corrosion resistant layer system for opto-electronic displays is produced by vapor deposition techniques. In accordance with the invention, the layer system is formed of two layers; a transparent first layer formed of a nonsolderable oxide semiconductor, such as In.sub.2 O.sub.3 SnO.sub.2, and a second layer formed of a solderable, oxidation-resistant material, which is formed at least partially of a copper alloy containing an alloying additive consisting of a metal which is less noble than copper, illustratively CuMg.

Layer system for opto-electronic displays

Indium-tin alloy targets are high-frequency cathode sputtered using water vapor with a pressure of between 10.sup.-3 mbar and 5.times.10.sup.-3 mbar as the reaction gas. The temperature-sensitive substrates used are water-cooled during the deposition. This is a continuation of application Ser. No. 168,244 filed July 10, 1980, now abandoned.

Method for preparing transparent, electrically conducting indium oxide

In order to bring about durable solder joints on transparent thin film electrodes which themselves are not solderable, the conductive layer is treated as follows. First, the conductive layer is applied in a vacuum and, more specifically, in the fully oxidized state, and then a solderable layer is generated on the conductive layer in the same vacuum. The electrode consists preferably of an indiumtin oxide and the solder layer consists of copper. The proposed coating technique is particularly simple since the solder layer requires neither an adhesion aid nor a corrosion protection layer. If it consists of copper, it can withstand without difficulty, if it is thick enough, even small thermal stresses such as occur for instance in the fabrication of liquid crystal displays with cementing frame. The layer system is particularly well suited for the electrode leads of electro-optical displays such as liquid crystal displays.

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Nuremberg, Germany

Peter Schack