Osram Gmbh

Roche Diagnostics Operations, Inc.

Roche Diagnostics Gmbh

Osram Ag

F. Hoffmann-la Roche Ag

Osram S.p.a. - Societa' Riunite Osram Edison Clerici

Peter Sachsenweger

Thomas Preuschl

Guenter Hoetzl

Tobias Frost

Thomas Weiss

Richard Forster

Hans-Juergen Kuhr

Nicole Breidenassel

Steven Nelson Roe

Alessandro Scordino

Robert Kraus

Ralph Bertram

Simon Schwalenberg

Alessandro Bizzotto

Junhua Zeng

Karl-Peter Ebert

Lorenzo Roberto Trevisanello

Stefan Lorenz

Chris Wiegel

Xuefeng Wang

Klaus Burkard

Yuli Chen

David Dussault

Filippo Branchetti

Gerhard Holzapfel

Steven Wetzel

Zhenjian Liang

Huey Ling Lim

Wilhelm Hildebrandt

Matt Hannant

Hoetzl Guenter

Various embodiments may relate to an optoelectronic assembly, including a printed circuit board, which has a first and a second sides, a central cutout, at least one contact cutout and, at least one connection location, a carrier element coupled to the printed circuit board, has a first side and at least one contact location, at least one optoelectronic component arranged on the first side of the carrier element in such a way that it is exposed in the central cutout of the printed circuit board, a housing body, which has a central cutout and which is formed and physically coupled to the printed circuit board such that the optoelectronic component is exposed in the central cutout, and at least one contact element arranged on an inner side of the housing body is formed such that the contact element electrically couples the contact location of the carrier element to the connection location.

Optoelectronic assembly and method for producing an optoelectronic assembly

An illuminating device includes: at least one lighting module, and at least one lighting module support, wherein the lighting module support is provided in order to dissipate heat from the lighting module and at least one first fastening element for fastening the lighting module on the lighting module support is provided, wherein the first fastening element is designed in such a way that the lighting module is pressed with a defined pressing force onto the lighting module support in such a way that a defined transfer of heat between the lighting module and lighting module support is enabled, and, in the region of the first fastening element, a movement of the lighting module, in particular a thermal expansion, parallel to the main plane of the lighting module is enabled.

LED module with a heat sink

Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.

Lighting module

Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and at least one electronic component, which is integrated in the covering element and is electrically connected to the first printed circuit board.

A fastening element for fastening a light source substrate to a support. The fastening element is configured to be seated on the light source substrate, and includes at least one fastening portion for fastening to the support.

Fastening element, luminous module and luminous apparatus

An LED module may include at least one passage opening from a first side of the LED module to a mounting side of the LED module, located opposite the first side. The passage opening is formed in such a way that a screw for fixing the LED module to a mounting element can be inserted into the passage opening from the first side to the mounting side of the LED module, and with a film which, at least in part, is arranged in an adhesive manner on the first side of the LED module. The film has at least one structure which includes at least one piercing of the film in the area of the at least one passage opening of the LED module.

LED module with protective film

A lighting device may include: a mount, which is populated with at least one electronic component and with at least one semiconductor light source, a cover for covering at least one electronic component and at least one connecting element for fastening the cover to the mount, wherein the connecting element is connected to the mount by means of a non-latching connection and to the cover by means of a latching connection.

Securing a support and covering a lighting device

LED lighting module

A printed circuit board (), having a front side () for population with at least one semiconductor light source () and having at least one securing element () accessible via a rear side (), wherein the at least one securing element () is embodied as an electrical through-conduction element for at least one of the semiconductor light sources.

Assembly having a semiconductor light source and support for a printed circuit board, and method for mounting the assembly

An illumination device may include a heat sink, on which at least one light source is fastened at least indirectly, wherein the heat sink is held movably in a holder in such a way that the heat sink moves with greater difficulty in an energized state of the light source than in a de-energized state of the light source.

Illumination device having a heat sink and method for directing a light bundle emitted by an illumination device

A lighting module, comprising a printed circuit board, which on the front side thereof, is populated by at least one light source as well as at least one light sensor; a hollow optical waveguide element, which laterally surrounds the at least one light source circumferentially; and a cover at least for the light sensor, arranged on the printed circuit board externally to the optical waveguide element, it being possible for a window to be located in the optical waveguide element to which window is connected a hollow light channel formed in and/or on the cover which leads to the light sensor.

A lighting device, having at least one light outlet opening and at least two different fixing interfaces for the optional fixing of a respective attachment element optically upstream of the at least one light outlet opening.

Lighting device and attachment element for fixing to the lighting device

A lighting module (), comprising: a circuit board (), on which are mounted at least one component (; L;) and at least one attachment element; (), wherein the at least one attachment element () is fastened on the at least one component (; L;) mounted on the circuit board () in a locking manner.

Lighting module, lighting device comprising a lighting module, method for assembling a lighting module and method for assembly of a lighting device

A mounting structure for solid-state light sources, for example of the LED type, comprises a support board; a submount mounted on said support board and having at least one solid-state light radiation source mounted thereon; a drive board carrying drive circuitry for the light radiation source, the aforementioned drive board being mounted on the support board and extending peripherally with respect to the aforementioned submount; electrical interface connections between the submount and the drive board for connecting the light radiation source to the drive circuitry; and mechanical and thermal interface connections between the submount and the support board.

Growing community of inventors

Zeitlarn, Germany

Peter Sachsenweger