Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien

Peter Romeder

Maximilian Stadler

Gunter Schwab

Max Stadler

Gabriele Trifellner

Schwab Gunter

A process for treating semiconductor material with an acid-containing fluid, has water being formed as a product of a chemical reaction. Before and/or during the treatment of the semiconductor material, phosphorus pentoxide is added to the acid-containing fluid.

Process for treating semiconductor material with an acid-containing fluid

A process for the wet-chemical treatment of workpieces, especially of semiconductor wafers, includes exposing the workpieces to a flow of a gassified treatment medium generated by homogeneously dispersing gas bubbles in a liquid.

Process for the wet-chemical treatment of disk-shaped workpieces

A magazine is provided for holding disk-type workpieces, in particular seonductor wafers, in the wet-chemical surface treatment in liquid baths. The magazine is particularly useful for etching semiconductor wafers in a liquid bath, which contains an insert (5) which has a diameter of 1.1-1.9 times the diameter of the wafer (6) and which has arrangements of guide strut assemblies (12) held parallel at a spacing of at least twice the wafer thickness by spacing struts (8). The guide strut assemblies (12) comprise main guide struts (9) and subsidiary guide struts (10) which diverge at the linking points (13), which do not lie on the housing axis, in not more than three directions. This etching magazine makes possible a marked reduction in the deterioration in the wafer geometry normally observed in etching treatments.

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Burghausen, Germany

Peter Romeder