Ams Sensors Singapore Pte. Ltd.

Heptagon Micro Optics Pte. Ltd.

International Business Machines Corporation

Uniphase Laser Enterprise Ag

Peter Roentgen

Markus Rossi

Hartmut Rudmann

Jens Geiger

Mario Cesana

Vincenzo Condorelli

Bassam Hallal

Ohad Meitav

Peter Riel

Wilhelm Heuberger

Matthias Maluck

Stephan Heimgartner

Moshe Doron

Tobias Senn

Florin Cutu

Javier Miguel Sánchez

Alireza Yasan

Abram Jakubowicz

Kotaro Ishizaki

Alexander Bietsch

Kai Engelhardt

Christoph S Harder

Jukka Alasirnio

Gian-Luca Bona

James Eilertsen

Camilla Camarri

Marcel Gasser

Volker Graf

Ernst-Eberhard Latta

Peter Unger

Albertus Oosenbrug

Francesco Paolo D'aleo

Hans Peter Dietrich

Eberhard Latta

Elisa Parola

Francesco Paolo D'Aleo

Nicholas I Buchan

Willi Heuberger

Javier Miguel-Sánchez

Yvan Galeuchet

William Patrick

Erica Williams

Andreas Daetwyler

Urs Deutsch

A method of calibrating a driving parameter of an optical component across an operating wavelength range of the component. The method comprises placing a layer of material in a light path, the layer of material being substantially planar and substantially transparent and having a thickness of the order of wavelengths in said range and operating said component to vary said driving parameter whilst detecting light transmitted through said layer of material to obtain driving parameter versus light intensity data. The obtained data is then compared with characterizing data previously derived for said layer of material in order to calibrate said driving parameter.

Detector wavelength calibration

According to a first aspect of the present invention there is provided a method of measuring the optical reflectance R of a target using a detection system comprising a light emitter and a light detector spaced apart from one another. The method comprises illuminating the target with the light emitter, detecting light reflected from the target using the light detector, wherein the light detector provides an electrical output signal Sindicative of the intensity of the detected light, and determining the optical reflectance R of the target according to (Formula 1), where Ris the spectral reflectance of a reference standard, Sis the detector electrical output signal with the reference standard in place, Sis the detector electrical output signal with no target in front of the light emitter and light detector, and M is a calibration factor.

Optical detection system calibration

Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Image sensor modules including primary high-resolution imagers and secondary imagers

Calibrating a spectrometer module includes performing measurements using the spectrometer module to generate wavelength-versus-operating parameter calibration data for the spectrometer module, performing measurements using the spectrometer module to generate optical crosstalk and dark noise calibration data for the spectrometer module, and performing measurements using the spectrometer module to generate full system response calibration data, against a known reflectivity standard, for the spectrometer module. The method further includes storing in memory, coupled to the spectrometer module, a calibration record that incorporates the wavelength-versus-operating parameter calibration data, the optical crosstalk and dark noise calibration data, and the full system response calibration data, and applying the calibration record to measurements by the spectrometer module.

Spectrometer calibration

Compact spectrometer modules include an illumination channel and a detection channel. The illumination channel includes an illumination source operable to generate a broad spectrum of electromagnetic radiation. The detection channel includes an illumination detector and a Fabry-Perot component. The Fabry-Perot component is operable to pass a narrow spectrum of wavelengths to the illumination detector. Further, the Fabry-Perot component can be actuatable such that the Fabry-Perot component is operable to pass a plurality of narrow spectrums of wavelengths to the illumination detector.

Compact spectrometer modules

The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected pass through.

Compact, power-efficient stacked broadband optical emitters

Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

Optoelectronic modules having a silicon substrate, and fabrication methods for such modules

The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected wavelength or narrow range of wavelengths to pass through.

The present disclosure describes optical radiation sensors and detection techniques that facilitate assigning a specific wavelength to a measured photocurrent. The techniques can be used to determine the spectral emission characteristics of a radiation source. In one aspect, a method of determining spectral emission characteristics of incident radiation includes sensing at least some of the incident radiation using a light detector having first and second photosensitive regions whose optical responsivity characteristics differ from one another. The method further includes identifying a wavelength of the incident radiation based on a ratio of a photocurrent from the first region and a photocurrent from the second region.

Determining spectral emission characteristics of incident radiation

Various optoelectronic modules are described that include an emitter operable to produce light (e.g., electromagnetic radiation in the visible or non-visible ranges), an emitter optical assembly aligned with the emitter so as to illuminate an object outside the module with light produced by the emitter, a detector operable to detect light at one or more wavelengths produced by the emitter, and a detector optical assembly aligned with the detector so as to direct light reflected by the object toward the detector. In some implementations, the modules include features for expanding or shifting the linear photocurrent response of the detector.

Optoelectronic module operable for distance measurements

The wafer stack () comprises a first wafer (OW1) referred to as optics wafer and a second wafer (SW) referred to as spacer wafer, said optics wafer (OW1) having manufacturing irregularities. The spacer wafer (SW) is structured such that it at least partially compensates for said manufacturing irregularities. The corresponding method for manufacturing a device, which in particular can be an optical device, comprises carrying out a correction step for at least partially compensating for manufacturing irregularities. Such a correction step comprises providing a wafer (SW) referred to as spacer wafer, wherein that spacer wafer is structured for at least partially compensating for said manufacturing irregularities. Those manufacturing irregularities may comprise a deviation from a nominal value, e.g., a irregularities in focal length. The invention can allow to mass produce high-precision devices at a high yield.

Wafer-level fabrication of optical devices with front focal length correction

The present disclosure describes light conversion modules each having a single laser diode or multiple laser diodes. The light conversion modules can be particularly small in size (height and lateral footprint) and can overcome various challenges associated with the high optical power and heat emitted by laser diodes. In some implementations, the light conversion modules include glass phosphors, which, in some instances, can resist degradation caused by the optical power and/or heat generated by the laser diodes. In some instances, the light conversion modules include optical filters which, in some instances, can reduce or eliminate human eye-safety risk.

Light conversion modules having a laser diode light conversion assembly and long pass filter reflecting light back to the light conversion assembly

Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features

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Thalwil, Switzerland

Peter Roentgen