International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Peter Robert Seidel

Pravin S Patel

Justin Potok Bandholz

Bradley Donald Herrman

Rubina Firdaus Ahmed

Bhyrav M Mutnury

Moises Cases

Brian Michael Kerrigan

Philip Louis Weinstein

Edward John McNulty

Hayden C Cranford, Jr

Todd Morgan Rasmus

Vernon Roberts Norman

Jeffrey Ross Hamilton

Stacy J Garvin

Sumanta Kumar Bahali

Juan Q Hernandez

Brian E Bigelow

Kent Barclay Howieson

An apparatus for memory management a high-speed fabric controller and a memory controller connected between a high-speed memory and a processor. The memory controller is configured to control processor access to the high-speed memory over a memory bus between the processor and the high-speed memory. The apparatus includes a high-speed data connection between the memory controller and the high-speed fabric controller and a data connection between a tier of persistent data storage and the high-speed fabric controller. The high-speed fabric controller is configured to control data transfers between the tier of persistent data storage over and the high-speed memory independent of the processor.

Controlling data transfers between a tier of persistent data storage and processor memory with a high-speed fabric controller

An integrated circuit (IC) that includes a semiconductor die in an IC package. The semiconductor die includes an electrical endpoint. The IC also includes a pad affixed to the semiconductor die. The pad is characterized by a capacitance and is coupled to the electrical endpoint. The IC also includes a bond wire coupling the pad to an IC package pin. The bond wire is an inductor characterized by an inductance. The inductance is configured to decrease signal degradation caused by the capacitance of the pad on electrical signals transmitted between the pin and the electrical endpoint of the semiconductor die.

Integrated circuit with inductive bond wires

A DIMM riser card that includes a PCB having a first edge, a second edge, and one or more faces. The first edge of the PCB is configured for insertion into a main board DIMM socket. The first edge includes electrical traces that electrically couple to a memory bus. The DIMM riser card includes an angled DIMM socket mounted on one face of the PCB, where the angled DIMM socket is configured to accept a DIMM at an angle not perpendicular to the PCB and electrically couple the DIMM to the memory bus. The DIMM riser card includes a straddle mount DIMM socket mounted on the second edge of the PCB. The straddle mount DIMM socket is configured to accept a DIMM and electrically couple the DIMM to the memory bus through the electrical traces on the first edge of the PCB.

DIMM riser care with an angled DIMM socket and a straddle mount DIMM socket

DIMM riser card with an angled DIMM socket and a straddled mount DIMM socket

Testing an electrical component, the component including a printed circuit board ('PCB') with a number of traces, the traces organized in pairs with each trace of a pair carrying current in opposite directions and separated from one another by a substrate layer of the PCB, where testing of the electrical component includes: dynamically and iteratively until a present impedance for a pair of traces of the component is greater than a predetermined threshold impedance: increasing, by an impedance varying device at the behest of a testing device, magnetic field strength of a magnetic field applied to the pair of traces by the impedance varying device, including increasing the present impedance of the pair of traces; measuring, by the testing device, one or more operating parameters; and recording, by the testing device, the measurements of the operating parameters.

Testing an electrical component

Embodiments of the invention include a common mode cancellation circuit and method for correcting signal skew in a differential circuit. According to one embodiment, an op amp circuit is used to correct the mismatch between transmission line lengths in the differential circuit. The CMCC can be embodied as an ASIC and added on to an existing differential signaling systems to correct and compensate for board wiring skew or other causes of phase misalignment. The result is restoration of the cross-over intersection of the plus and minus signals of the differential pair closer to the common voltage level point, as if the signals had been in phase.

Common mode cancellation in differential networks

A method of electrically qualifying high speed printed circuit board (PCB) connectors includes mounting a PCB connector on a test card, sending bit patterns through a first portion of the test card, evaluating a waveform on a sense signal on a second portion of the test card for the bit patterns launched on said first portion of the test card to measure common mode noise, and comparing the measured common mode noise of the second portion of the test card to a golden standard performed on a pre-qualified connector. The first portion of the test card comprises connectors to inject bit patterns. The second portion of the test card includes a split plane which induces common mode noise on a sense signal, the sense signal, and a termination pack. If the measured common mode noise on the PCB connector is worse than the golden standard, then the PCB connector is disqualified. If the measured common mode noise on the PCB connector is as good as or better than the golden standard, then the PCB connector is qualified. A first section of the PCB connector connects to the first portion of the test card and a second section of the PCB connector connects to the second portion of the test card. Transmission lines in the test card and the sense line are tightly coupled by shortening a distance between the sense line and the transmission lines.

Method and apparatus to electrically qualify high speed PCB connectors

A self-adaptive voltage regulator for a phase-locked loop is disclosed. The phase-locked loop includes a phase detector, a charge pump, a low pass filter, and a voltage control oscillator, wherein the low pass filter inputs a control voltage to a voltage controlled oscillator for generation of an output clock. According to the method and system disclosed herein, the self-adaptive voltage regulator is coupled to an output of the low pass filter for sensing the control voltage during normal operation of the phase-locked loop, and for dynamically adjusting the supply voltage, which is input to the voltage controlled oscillator in response to the control voltage, such that the phase-locked loop maintains the control voltage within a predefined range of a reference voltage.

Self-adaptive voltage regulator for a phase-locked loop

Growing community of inventors

Cary, NC, United States of America

Peter Robert Seidel