Octavo Systems LLC

Nan Ya Technology Corporation

Assured Enterprises, Inc.

Peter Robert Linder

Gene A Frantz

Erik James Welsh

Masood Murtuza

Laurence Ray Simar, Jr

William Arthur Fitzhugh Lee

James S Wallace

Kevin Michael Troy

Jeffrey Johnson

A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.

Secure enclave system-in-package

High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.

High performance module for SiP

A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.

System and method of assembling a system

A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

Component communications in system-in-package systems

The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.

Analog memory cells with valid flag

The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.

Analog arithmetic unit

Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.

EMI shield for molded packages

The present disclosure describes a mixed signal computer unit using a combination of analog and digital components/elements in a cohesive manner. Depending on the signals and data that need to be processed, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize the computational results and the performance of the computation. Operations may be controlled by one or more digital cores.

Mixed signal computer

In one or more embodiments, an encryption key of a device may be split into multiple segments. One of the segments may be retained by an owner of the device, and some of the segments may be distributed to multiple entities. For example, one of the segments may be provided to a service provider, and one of the segments may be provided to an escrow agent. The escrow agent may process its segment, provide information based on its segment to a public ledger, and destroy its segment. A proxy agent may retrieve, from the public ledger, the information based on the segment provided to the escrow agent and obtain compensation. When the proxy agent obtains the compensation, the public ledger exhibits information utilizable to obtain the segment provided to the escrow agent. With the segments provided to the escrow agent and the service provider, the encryption key may be obtained.

Utilization of a proxy technique in escrow encryption key usage

Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.

Reduction of passive components in system-in-package devices

A memory device is coupled to a subset of lines of a data input/output (I/O) bus. The memory device includes an on-die active termination circuit for terminating the subset of lines of the data I/O bus with a selected impedance being one of a plurality of selectable impedances; a termination value register being coupled to the on-die active termination circuit for storing a value representing the selected impedance; and a termination value setting circuit being coupled to the termination value register, for setting the value representing the selected impedance in the termination value register.

Growing community of inventors

Sugar Land, TX, United States of America

Peter Robert Linder