Nan Chang O-film Optoelectronics Technology Ltd

Peter Pietrangelo

Eddie Azuma

Giles Humpston

Ellis Chau

Harpuneet Singh

Ocie Ward

Emerson Yu

David Hsieh

Chih Yen Liu

Josh Tsai

A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same

A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.

Auto-focus camera module with flexible printed circuit extension

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San Jose, CA, United States of America

Peter Pietrangelo