Enthone Incorporated

Coventya Gmbh

Peter Pies

Andreas Möbius

Christoph Werner

Gianluigi Schiavon

Andreas Königshofen

Mykolas Baranauskas

Sandrine Dalbin

Leonas Naruskevicius

Danica Elbick

Nicolas Pommier

Wolfgang Clauberg

Jonas Vinkevicius

Grigorijus Rozovskis

The invention refers to a process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath.

Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath

An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises

Electrolyte and process for depositing a matt metal layer

A process for the metallization of a plastic surface, whereby the following process steps are performed in sequence, one after another. The plastic surface is subjected to an etching treatment under mild etching conditions. Subsequently, the plastic surface is treated with a metal salt solution, containing at least one salt from the following group: cobalt salt, silver salt, tin salt, and lead salt. The plastic surface is treated with a sulfide solution. Finally, the plastic surface is metallized in a metallizing bath.

Process for metallizing a plastic surface

Process for the direct metallizing of the surface of a plastic object. The surface of the plastic object is roughened by pickling. The surface is activated with the aid of a colloidal or ionogenic aqueous solution of a first precious metal, which colloidal or ionogenic aqueous solution also contains a second base metal. This forms an activation coat on the surface containing the first precious and the second base metals. Electron conductivity of the activation coat is provided with the aid of a treatment solution, with which the second base metal is at least partially dissolved out of the activation coat and an electron conducting substance is adsorb in the activation coat. Then the electron-conductive activation coat is metallized. Before the electron conducting activation coat is metallized, the sequence of steps &ldquo;activation of the surface and establishment of electronic conductivity&rdquo; is repeated at least once.

Double-dip Pd/Sn crosslinker

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Cologne, Germany

Peter Pies