Northrop Grumman Systems Corporation

Peter Ngo

Chunbo Zhang

Gershon Akerling

Patty P Chang-Chien

William Roland Deal

Kevin M Leong

Kelly Jill Hennig

A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

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Cypress, CA, United States of America

Peter Ngo