Digital Direct Ir, Inc.

Public Service Solutions, Inc.

Owl Peak Technologies, Inc.

Renewable Energy Products Manufacturing Corp.

Peter N Kaufman

Howard E Carpenter

Nuggehalli M Ravindra

Infrared imaging devices are provided which are configured to implement side-scan infrared imaging for, e.g., medical applications. For example, an imaging device includes a ring-shaped detector element comprising a circular array of infrared detectors configured to detect thermal infrared radiation, and a focusing element configured to focus incident infrared radiation towards the circular array of infrared detectors. The imaging device can be an ingestible imaging device (e.g., swallowable camera) or the imaging device can be implemented as part of an endoscope device, for example.

Side-scan infrared imaging devices

Systems and methods are provided for protecting solar panels from damage due to overheating. A system comprises a solar panel and a control system. The solar panel comprises a plurality of solar cells, and a plurality of thermochromic temperature sensors thermally coupled to different areas of the solar panel. The thermochromic temperature sensors are configured to change color in response to heat generated by the solar cells in the different areas of the solar panel. The control system is configured to detect colors of the thermochromic temperature sensors, determine a temperature of each area of the solar panel based on the detected colors of the thermochromic temperature sensors, and cause the solar panel to shut down in response to determining that the temperature of at least one area of the solar panel exceeds a predetermined temperature threshold.

Protecting solar panels from damage due to overheating

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum.

Passive detectors for imaging systems

Spherical detector array devices are provided, which are implemented using passive detector structures for thermal imaging applications. Passive detector structures are configured with unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in the thermal IR portion of the electromagnetic spectrum.

Spherical detector arrays implemented using passive detector structures for thermal imaging applications

Multi-spectrum imaging systems and methods are provided for imaging in multiple spectrums, e.g., thermal IR (infrared) at wavelengths of 4 microns and 11 microns, near-IR, and visible light, all on a same optical centerline. For example, an imaging system includes a first imager and a second imager. The first imager includes an array of thermal IR detectors, wherein the first imager is configured to receive incident photonic radiation and generate a thermal IR image, wherein each thermal IR detector comprises a photon absorber member that is configured to absorb thermal IR photonic radiation from the incident photonic radiation, and reflect remaining photonic radiation in the incident photonic radiation along an optical path of the imaging system. The second imager is disposed in said optical path of the imaging system, wherein the second imager is configured to receive the remaining photonic radiation reflected from the first imager and generate a second image.

Multi-spectrum imaging

Multi-spectrum imaging systems and methods are provided to imaging in multiple spectrums, e.g., thermal IR (infrared) at 4 &#x3bc;m and 10 &#x3bc;m wavelengths, near-IR, and visible light, all on a same optical centerline. For example, an imaging system includes a first imager and a second imager. The first imager includes an array of thermal IR detectors, wherein the first imager is configured to receive incident photonic radiation and generate a thermal IR image, wherein each thermal IR detector comprises a photon absorber member that is configured to absorb thermal IR photonic radiation from the incident photonic radiation, and reflect remaining photonic radiation in the incident photonic radiation along an optical path of the imaging system. The second imager is disposed in said optical path of the imaging system, wherein the second imager is configured to receive the remaining photonic radiation reflected from the first imager and generate a second image.

Passive detector structures for imaging systems are provided, which are based on a coefficient of thermal expansion (CTE) framework. With such framework, a CTE-based passive detector structure includes a detector member that is configured to expand or contract in response to thermal heating resulting from photon exposure. The expanding/contracting CTE detector structure is configured to exert mechanical forces on resistor and/or capacitor circuit elements, which are part of an oscillator circuit, to vary the resistance and capacitance of such circuit elements and change a frequency or period of oscillation of an output signal of the oscillator circuit. The change in the frequency or period of oscillation of the output signal of the oscillator circuit is utilized to determine an amount of photon exposure of the CTE-based detector.

A room temperature infrared imager, fabricated using MEMS (Micro Electro Mechanical Systems) techniques, made up of individually functioning analog elements laid out in a horizontal and vertical block matrix (pixel array). The front of each individual pixel element is IR sensitive and varies its properties in proportion to the corresponding analog level of incident IR energy exposure. An image infrared energy is focused across the front of the array to ultimately create a visible light image. The detector elements are formed on the front of a substrate. On the rear of the substrate, right behind the detectors, are electronics which read the sensors exposure level. Formed on top of the electronics are Light Emitting Devices (LED's). The electronics vary the brightness of the LED's proportionally with the exposure level on the front of the detector. The image is formed by the different visible light levels that appear on the array readout.

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Fresh Meadows, NY, United States of America

Peter N Kaufman