Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Peter Merz

Hans-Joachim Quenzer

Wolfgang Reinert

Hans Joachim Quenzer

Marten Oldsen

Arne Schulz

Uwe Bott

Manfred Weiss

Bernd Wagner

Oliver Schwarzelbach

Klaus Reimer

Dirk Kaehler

Arne-Veit Schulz

Manfred Weiß

Arne Veit Schulz

The invention relates to a micromechanical Coriolis rate of rotation sensor for detecting rates of rotation with components around measuring axes in three spatial directions which are orthogonal to one another. The Coriolis rate of rotation sensor has a substrate, a detection mass and at least two drive masses, wherein the drive masses can each be driven to perform a primary movement relative to the substrate. The direction of the primary movement of one of the at least two drive masses is perpendicular to the direction of the primary movement of another of the at least two drive masses. The detection mass is coupled to the drive masses. The invention also relates to an Inertial Measurement Unit (IMU) and to a method for detecting rates of rotation in three spatial directions which are orthogonal to one another.

Micromechanical Coriolis rate of rotation sensor

The present application relates to a multiple component which is to be subsequently individualized by forming components containing active structures, in addition to a corresponding component which can be used in microsystem technology systems. The multiple component and/or component comprises a flat substrate and also a flat cap structure which are bound to each other such that they surround at least one first and one second cavity per component, which are sealed against each other and towards the outside. The first of the two cavities is provided with getter material and due to the getter material has a different internal pressure and/or a different gas composition than the second cavity. The present application also relates to a method for producing the type of component and/or components for which gas mixtures of various types of gas have a different absorption ratio in relation to the getter material.

Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof

A rotation rate sensor for sensing a rotation &#x3a9; by which the sensor is rotated has a substrate and a driving and sensing arrangement located substantially flat in an X-Y plane above a substrate surface of the substrate and having a center. The driving and sensing arrangement has a drive mass and a sense mass that are arranged at different spacings from the center of the driving and sensing arrangement symmetrically about the center. The oscillation modes of the drive mass and the sense mass are partially transmittable onto one another and are partially decoupled. The rotation &#x3a9; is sensed in that a tilting of the sense mass out of a surface plane of the driving and sensing arrangement is sensed. A first one of the drive and sense masses that has a greater spacing to the center is tilted under the effect of Coriolis force out of the surface plane The first one of the drive and sense masses is connected by symmetrically arranged external anchors to the substrate such that a restoring action for the tilting action of the first one of the drive and sense masses is assisted by the external anchors.

Micromechanical inertial sensor for measuring rotation rates

The invention relates to a cover wafer with a core and with an inside, whereby the inside has one or more annular outer areas, (an) annular area(s), which inwardly adjoin(s) the outer area(s), and has (a) inner area(s), and to a component cover with only one annular outer area on its inside. The invention is characterized in that at least area(s) has/have a buffer layer, which has a wetting angle of &#x3c;35&#xb0; for a metallic eutectic solution that melts in a range of &#x3e;265&#xb0; C. to 450&#xb0; C. The invention also relates to a component cover having one of the areas which has said buffer layer in a comparable manner. The invention additionally relates to a wafer component or to a component, which can be inserted using microsystem technology and which has a cover wafer or component cover applied with the aid of a solder material, and to a method for the production thereof.

Solder material lining a cover wafer attached to wafer substrate

A method and a device are disclosed for follow-up treatment of the contour of the surface of at least one optical lens, in particular a microlens which is made of glass or a glass-type material and which has a convex lens surface delimited by a circumferential line abutting on a plane section surrounding the circumferential line and which has a lens underside facing the convex lens surface. Along the circumferential line of the optical lens on the plane section is placed a device perfectly matching the circumferential line and at least laterally bordering the convex lens surface, the optical lens is heated to a temperature of at least the transformation temperature of glass or glass-type material, pressure equalization prevails between the convex lens surface and the lens underside, after a certain period of time, during which the optical lens undergoes the temperature treatment and subsequent cooling below the transformation temperature, the device is removed from the optical lens.

Method and device for selectively changing the contour of the surface of an optical lens made of glass or a glass-type material

The present invention is directed to a method for testing the leakage rate of an encapsulated device comprising the step: bombing the device with a neon and/or argon atmosphere using a bombing pressure of at least more than environmental pressure and measuring the quality factor before and after bombing. Preferably, the bombing time is about 10 to 100 hours, and the bombing pressure is 1.5 to 100 bar, more preferably 1.5 to 5 bar and most preferably about 4 bar. With this test, the leakage rate of fine leaks of the device may be determined.

Method for testing the leakage rate of vacuum encapsulated devices

Disclosed is a method for producing single microlenses or an arrays of microlenses composed of a glass-type material, in which method a first substrate is provided with a surface containing impressions over which a second substrate composed of a glass-type material is placed at least partially overlapping it and is joined therewith under vacuum conditions. The substrate composite is tempered in such a manner that the second substrate softens and flows into the impressions of the first substrate, thereby structuring the side of the second substrate facing away from the first substrate in order to form at least one microlens surface.

Method for producing single microlenses or an array of microlenses

Disclosed is a method for structuring a flat substrate consisting of a glass-type material. The invented method is distinguished by a combination of the following steps: providing a semiconductor flat substrate consisting of a semiconductor material, structuring at least one surface of said semiconductor flat substrate to obtain recesses in said surface, connecting said surface of said semiconductor flat substrate to said glass-type flat substrate, with said structured surface of said semiconductor flat substrate being connected to a surface of said glass-type flat surface at least partially covering the same,tempering said connected flat substrates in such a manner that at least a part of the said glass-type material flows into said recesses of said structured surface of said semiconductor flat substrate,removing material at least from the resolidified glass-type flat substrate in such a manner that said glass-type flat substrate assumes a surface which is flush with said structured surface of said semiconductor flat substrate.

Method for structuring a flat substrate consisting of a glass-type material

A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.

Method of creating a predefined internal pressure within a cavity of a semiconductor device

What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Method for producing micromechanical and micro-optic components consisting of glass-type materials

The invented method is distinguished by a combination of the following method steps:

Glass-type planar substrate, use thereof, and method for the production thereof

What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type substrate in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Growing community of inventors

Hanerau-Hademarschen, Germany

Peter Merz