Telefonaktiebolaget Lm Ericsson (publ)

Peter Melin

Anatoli Deleniv

Per Ingelhag

Ove Persson

The present disclosure relates to waveguide band-stop filter arrangement adapted to be connected to a waveguide transmission line at a filter interface, where the waveguide transmission line is adapted for a main propagation extension. The band-stop filter arrangement comprises a first pair of cavities, where each cavity in the first pair, each first pair cavity, comprises a corresponding inductive first pair aperture arrangement that is adapted to connect the corresponding first pair cavity to the waveguide transmission line. The first pair cavities are positioned adjacent each other along a stacking extension perpendicular to the main propagation extension such that they share a first common wall and are adapted to be positioned adjacent the waveguide transmission line. The first pair of cavities comprises a first capacitive aperture arrangement in the first common wall, mutually connecting the first pair cavities.

Waveguide band-stop filter arrangement

The present disclosure relates to a waveguide arrangement including a mounting printed circuit board, PCB, and at least a first waveguide layer. Each waveguide layer comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall. The PCB includes a signal interface for each waveguide conducting tube. The waveguide arrangement further includes at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer.

Cooling in a waveguide arrangement

The present invention relates to a carrier substrate () comprising signal vias () for electrically interconnecting components () arranged on opposing sides of the carrier substrate (). The carrier substrate () further comprises: at least one cavity () embedded in the carrier substrate () having at least one chamber wick part () and a working fluid, and wherein the at least one cavity () at least partially encompass the signal vias (). The present invention also relates to an electronic assembly and an apparatus for wireless communication comprising the carrier substrate ().

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Lindome, Sweden

Peter Melin