Xilinx, Inc.

Peter McColgan

Juan J Noguera Serra

David Clarke

Baris Ozgul

Jan Langer

Tim Tuan

Zachary Dickman

Goran H K Bilski

Goran Hk Bilski

Javier Cabezas Rodriguez

Sneha Bhalchandra Date

Amarnath Kasibhatla

Saurabh Mathur

Jose Marques

Pedro Miguel Parola Duarte

Stephan Münz

Christopher H Dick

Ralph D Wittig

Philip Bryn James-Roxby

Kornelis Antonius Vissers

Richard Lewis Walke

Francisco Barat Quesada

Dylan Stuart

An integrated circuit (IC) can include a data processing array including a plurality of compute tiles arranged in a grid. The IC can include an array interface coupled to the data processing array. The array interface includes a plurality of interface tiles. Each interface tile includes a plurality of direct memory access circuits. The IC can include a network-on-chip (NoC) coupled to the array interface. Each direct memory access circuit is communicatively linked to the NoC via an independent communication channel.

Data processing array interface having interface tiles with multiple direct memory access circuits

Using multiple overlays with a data processing array includes loading an application in a data processing array. The data processing array includes a plurality of compute tiles each having a processor. The application specifies kernels executable by the processors and implements stream channels that convey data to the plurality of compute tiles. During runtime of the application, a plurality of overlays are sequentially implemented in the data processing array. Each overlay implements a different mode of data movement in the data processing array via the stream channels. For each overlay implemented, a workload is performed by moving data to the plurality of compute tiles based on the respective mode of data movement.

Multiple overlays for use with a data processing array

An apparatus includes a data processing array having a plurality of array tiles. Each array tile can include a random-access memory (RAM) having a local memory interface accessible by circuitry within the array tile and an adjacent memory interface accessible by circuitry disposed within an adjacent array tile. Each adjacent memory interface of each array tile can include isolation logic that is programmable to allow the circuitry disposed within the adjacent array tile to access the RAM or prevent the circuitry disposed within the adjacent array tile from accessing the RAM. The data processing array can be subdivided into a plurality of partitions wherein the isolation logic of the adjacent memory interfaces is programmed to prevent array tiles from accessing RAMs across a boundary between the plurality of partitions.

Multiple partitions in a data processing array

Examples herein describe techniques for communicating between data processing engines in an array of data processing engines. In one embodiment, the array is a 2D array where each of the DPEs includes one or more cores. In addition to the cores, the data processing engines can include streaming interconnects which transmit streaming data using two different modes: circuit switching and packet switching. Circuit switching establishes reserved point-to-point communication paths between endpoints in the interconnect which routes data in a deterministic manner. Packet switching, in contrast, transmits streaming data that includes headers for routing data within the interconnect in a non-deterministic manner. In one embodiment, the streaming interconnects can have one or more ports configured to perform circuit switching and one or more ports configured to perform packet switching.

Dual mode interconnect

An integrated circuit having a data processing engine (DPE) array can include a plurality of memory tiles. A first memory tile can include a first direct memory access (DMA) engine, a first random-access memory (RAM) connected to the first DMA engine, and a first stream switch coupled to the first DMA engine. The first DMA engine may be coupled to a second RAM disposed in a second memory tile. The first stream switch may be coupled to a second stream switch disposed in the second memory tile.

Memory tiles in data processing engine array

An integrated circuit includes a plurality of data processing engines (DPEs) DPEs. Each DPE may include a core configured to perform computations. A first DPE of the plurality of DPEs includes a first core coupled to an input cascade connection of the first core. The input cascade connection is directly coupled to a plurality of source cores of the plurality of DPEs. The input cascade connection includes a plurality of inputs, wherein each of the plurality of inputs is connected to a cascade output of a different one of the plurality of source cores. The input cascade connection is programmable to enable a selected one of the plurality of inputs.

Data processing engines with cascade connected cores

An integrated circuit can include a data processing engine (DPE) array having a plurality of tiles. The plurality of tiles can include a plurality of DPE tiles, wherein each DPE tile includes a stream switch, a core configured to perform operations, and a memory module. The plurality of tiles can include a plurality of memory tiles, wherein each memory tile includes a stream switch, a direct memory access (DMA) engine, and a random-access memory. The DMA engine of each memory tile may be configured to access the random-access memory within the same memory tile and the random-access memory of at least one other memory tile. Selected ones of the plurality of DPE tiles may be configured to access selected ones of the plurality of memory tiles via the stream switches.

Data processing engine array architecture with memory tiles

Some examples described herein relate to multi-port stream switches of data processing engines (DPEs) of an electronic device, such as a programmable device. In an example, a programmable device includes a plurality of DPEs. Each DPE of the DPEs includes a hardened processor core and a stream switch. The stream switch is connected to respective stream switches of ones of the DPEs that neighbor the respective DPE in respective ones of directions. The stream switch has input ports associated with each direction of the directions and has output ports associated with each direction of the directions. For each direction of the directions, each input port of the input ports associated with the respective direction is selectively connectable to one of the output ports associated with the respective direction.

Multi-port stream switch for stream interconnect network

Examples herein describe techniques for communicating between data processing engines in an array of data processing engines. In one embodiment, the array is a 2D array where each of the DPEs includes one or more cores. In addition to the cores, the data processing engines can include a memory module (with memory banks for storing data) and an interconnect which provides connectivity between the engines. To transmit processed data, a data processing engine identifies a destination processing engine in the array. Once identified, the data processing engine can transmit the processed data using a reserved point-to-point communication path in the interconnect that couples the source and destination data processing engines.

Streaming interconnect architecture for data processing engine array

A device may include a plurality of data processing engines, a subsystem, and an SoC interface block coupled to the plurality of data processing engines and the subsystem. The SoC interface block may be configured to exchange data between the subsystem and the plurality of data processing engines.

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Dublin, Ireland

Peter McColgan