Cascade Microtech, Inc.

Formfactor, Inc.

Formfactor Beaverton, Inc.

Peter McCann

Daniel L Harris

Rod Jones

Terry Burcham

John L Dunklee

John T Martin

Tim Lesher

Koby L Duckworth

Anthony James Lord

Gavin Neil Fisher

Jeff Spencer

Craig Stewart

Rodney Jones

David Newton

Thomas Reiner Thaerigen

Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

Probe systems and methods

A test configuration for double sided probing of a device under test includes a holder to secure the device under test in a first orientation, a calibration substrate secured in a second orientation and a probe capable of calibration using the calibration substrate and probing the device under test.

Double sided probing structures

A chuck includes a conductive element that contacts a device under test in a location on the chuck. The chuck includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

Chuck for holding a device under test

A chuck that includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

A fiber optic wafer probe that includes a fibre optic cable for approaching a device under test.

Fiber optic wafer probe

A chuck adapted to test electrical and/or optical components on a device-under-test (DUT).

Optical testing device

A fiber optic wafer probe that includes a fiber optic cable for approaching a device under test.

A rotary chuck with indexed rotation promotes rapid rotation of a device under test and increases the productivity of a probe station on which the device is being tested. A device mounting member of a rotatable chuck is supported for rotation on a first surface of a base until a vacuum is applied drawing the device mounting member into contact with a second surface of the base and constraining the device mounting member against rotation.

Indexing rotatable chuck for a probe station

The arrangement of test points on an integrated circuit (IC) undergoing testing in a probe station often requires rotation of the IC or the probes when performing a series of tests. A chuck with indexed rotation promotes rapid rotation of the device under test to a new test position and increases the productivity of the probe station. The device under test is mounted on a device mounting member that is affixed to a shaft rotationally mounted in a base. A resilient seal supports the device mounting member and forms a sealed chamber over a substantial part of the area of the device mounting member. Applying vacuum or pressure to the sealed chamber urges the device mounting member and base toward contact. The support provided by the resilient seal over substantial portion of device mounting member's diameter promotes stability and consistent planarity of the device mounting member without regard to the orientation of the shaft to device mounting member.

Growing community of inventors

Beaverton, OR, United States of America

Peter McCann