Bae Systems Information and Electronic Systems Integration Inc.

Peter M Wallace

Keith K Sturcken

John A Hughes

Michael Richard Ehlert

Thomas O Perkins, Iii

Candice L Brittain

Sheila J Konecke

Ronald H Schmidt

Thomas E Love

Blair E Coburn

Jeffrey Montag

A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.

Devices and methods for stacking individually tested devices to form multi-chip electronic modules

A system is provided for the integration of microwave components in a low temperature co-fired ceramic, the system includes a low temperature co-fired ceramic body having a top surface, into which is disposed a plurality of cavities; a plurality of microwave devices, each device being disposed within a cavity such that the cavities provide radio isolation to the devices; and a coaxial connection disposed within the body configured to connect the devices to external components the coaxial components comprising vias disposed within the co-fired ceramic body.

Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology

Growing community of inventors

Newfields, NH, United States of America

Peter M Wallace