Rockwell Collins, Inc.

Peter M Sahayda

James B West

Russell David Wyse

Ross Keith Wilcoxon

Nathan P Lower

Reginald D Bean

Russell C Tawney

Ted J Hoffmann

Tyler J Wilson

Joseph M Bohl

David L Westergren

Lucas J Lower

A structural connector system for providing an electrical connection between electronic componentry is disclosed. The structural connector system includes a structural member, including an electrically insulating matrix, an electrically conducting path, a first end surface, a second end surface, and a first component engaging surface. The first component engaging surface includes a first mechanical coupler configured to mechanically couple a first electronic component or a first chassis component to the structural member and a first electrical coupler configured to electrically couple the first electronic component or the first chassis component to a first end of the electrically conducting path. The structural member further includes a second component engaging surface that includes a second mechanical coupler and a second electrical coupler configured to electrically couple the first electronic component, the first chassis component, the second electronic component, or the second chassis component to a second end of the electrically conducting path.

Assembly for chassis electrical and mechanical right-angle connection

A system and method are disclosed for producing nulls in a wideband jamming signal at specific frequency bands. A nulling signal is determined, either as a modification to one or more of the combined signals, or a separately determined nulling signal generated by combine a separate set of signals. The nulling signal is produced via feedback based on the output of the wideband jamming signal. Alternatively, a trained neural network outputs a nulling signal based on the wideband jamming signal and a desired availability band.

Wideband jammer nulling

A vertically integrated circuit assembly may include a substrate including a plurality of electrical traces, and a first circuit assembly layer disposed on the substrate. In embodiments, the first circuit assembly layer includes a first set of integrated circuit components, and a plurality of electrical interconnects configured to route signals through the first circuit assembly layer. In embodiments, the vertically integrated circuit assembly further includes a second circuit assembly layer coupled to the top surface of the first circuit assembly layer. The second circuit assembly layer may include a second set of integrated circuit components, and a plurality of electrical interconnects configured to route signals through the second circuit assembly layer. In embodiments, an electrical interconnect arrangement on a top surface of the first circuit assembly layer is configured to interface with an electrical interconnect arrangement on the bottom surface of the second circuit assembly layer.

Vertically integrated circuit assembly

An antenna system and method use an electronically-scanned antenna array and a hybrid beam former architecture. The antenna system includes a matrix of antenna elements and a feeder network. The feeder network includes a first layer including phase shifters. Each of the phase shifters is for a respective antenna element of the antenna elements. The feeder network also includes a second layer and a third layer. Each of the first set of the first time delay units in the second layer is for a respective first subarray of the first subarrays of the antenna elements. Each of the second set of the second time delay units in the third layer is for a respective second subarray of the second subarrays of the first subarrays.

Antenna system and method for a digitally beam formed intersecting fan beam

Growing community of inventors

Cedar Rapids, IA, United States of America

Peter M Sahayda